Siliconware Precision Industries Co., Ltd.

Expack Industrial Corporation

Expack Industriai. Corporation

Expack Indutrial Corporation

Yu-Ting Lai

Chien-Ping Huang

Chin-Te Chen

Charles Tseng

Chung-Pao Wang

Wei-Chen Tseng

Chin Te Chen

Shy-Hwa Feng

Kuan-Ting Kuo

Kuo-Chu Chiang

Chen Chien-Chih

Chin-Chien Chiang

Chin-Wen Lai

Ken-Hung Kuo

A box folding machine includes a base driving member, a pair of positioning units, and a base frame unit that has two opposite end portions. The base driving member is operable to drive the base frame unit to move between a first position, in which the end portions of the base frame unit are substantially arranged along a first direction, and a second position, in which the end portions of the base frame unit are substantially arranged along a second direction. Each of the positioning units includes a positioning seat. When the base frame unit is in the first position, the positioning seats of the positioning units are proximate to each other in the second direction and are misaligned from each other. When the base frame unit is in the second position, the positioning seats are distal from each other in the second direction.

Box folding machine

A strapping machine includes a driver, first and second power output units, and a switching unit. The first power output unit includes a first drive shaft being co-rotatable with a main shaft of the driver only when the main shaft rotates in a first rotational direction via a first one-way bearing for driving the switching unit, and for clamping, hot-melting and cutting a strap. The second power output unit includes a second drive shaft being co-rotatable with the main shaft only when the main shaft rotates in a second rotational direction via a second one-way bearing, and a plurality of output gear trains being engagable with the second drive shaft via the switching unit for feeding, retracting and tensioning the strap.

Strapping machine

A strap feeding device includes first driving and driven rollers, second driving and driven rollers, an actuating unit, and a detecting unit. The actuating unit can move the second driving roller between a released position, where the second driven roller is spaced apart from the second driving roller, and a contact, where the second driven roller contacts the second driving roller and is co-rotatable with the second driving roller to clamp and move a strap. The control device controls rotation of the first and second driving rollers to feed and return the strap, detects rotation of the first driven roller, and controls the actuating unit to move the second driven roller to the contact and released positions.

Strap feeding device for strapping machine

A feeding device is adapted to be installed to a box folding machine for delivering a plurality of unfolded cardboard boxes, and includes a base unit, a positioning unit and a box pushing unit. The base unit is operable for moving the cardboard boxes to push two stopping members of the positioning unit to rotate from a stopping position, where the cardboard boxes are retained between upstream and downstream ends of the base unit, to a releasing position, where one of the cardboard boxes is moved out of the downstream end to a standby position. The box pushing unit is operable to push the one of the cardboard boxes from the standby position to a ready-to-fold position, where the one of the cardboard boxes is ready to be folded.

Feeding device for a box folding machine

A foldable box sealing machine includes an upright main frame unit, an upper taping unit mounted on the main frame unit, a platform unit having a base panel mounted rotatably on the main frame unit below the upper taping unit, a lower taping unit disposed below the upper taping unit. The base panel is rotatable between a first position where the base panel is substantially horizontal, and a second position where the base panel is substantially vertical.

Foldable box sealing machine

A conductive trace structure and a semiconductor package having the conductive trace structure are provided. A plurality of conductive traces are formed in and surrounding a chip mounting area on a substrate, for mounting a chip on the chip mounting area. Widened portions are formed on the conductive traces in the chip mounting area and at positions across a periphery of the chip mounting area, the widened portions having a line width larger than that of the rest part of the conductive traces. The widened portions of the conductive traces can sustain concentrated thermal stress from the peripheral area of the chip caused by mismatch in coefficient of thermal expansion between the chip and the substrate. This prevents the conductive traces that pass through the periphery of the chip mounting area from cracks or breaks due to the thermal stress, thereby improving the reliability and yield of the semiconductor package.

Conductive trace structure and semiconductor package having the conductive trace structure

A substrate for a semiconductor package is provided, which includes: a core layer; at least a metal layer applied over each of upper and lower surfaces of the core layer, wherein the metal layer on the upper surface forms a plurality of conductive traces each having a terminal, and the metal layer on the lower surface is defined with a conductive region and a surrounding peripheral region, allowing the conductive region to form a plurality of conductive traces each having a terminal; and an insulating layer applied over each of the metal layers, wherein terminals of the conductive traces and at least a corner portion of the peripheral region are exposed to outside of the insulating layers. During fabrication of semiconductor packages, after a post molding curing process, the vertically-stacked substrates can be easily separated by virtue of a gap being formed between exposed corner portions of the stacked substrates.

Substrate for semiconductor package

A ball grid array semiconductor packaging technology is provided, which is characterized in that openings of a solder mask are formed on a given edge of a die attachment area, and entire or partial width of each opening is disposed outside the die attachment area. Accordingly, air within the opening of the solder mask is sufficiently eliminated during die bonding process, so as to prevent void formation as adhesive is filled into the opening. Therefore, in the follow-up steps, high temperature in reflowing process will not cause popcorn as in the prior-art, so as to remain good quality of the semiconductor package.

Ball grid array semiconductor package and method of fabricating the same

A chip carrier, a semiconductor package and a fabricating method thereof are proposed, in which on one side of the chip carrier finally removed from an engaged surface of a mold in a de-molding process there is formed at least one grounding means corresponding in position to an eject pin of the mold, so as to allow a gear amount of electrical static generated on a surface of the semiconductor package during molding and de-molding to be discharged to the outside, instead of being retained on a semiconductor chip, conductive elements and conductive traces of the semiconductor package. This therefore can prevent electrical leakage and damage to the semiconductor chip from occurrence, and improve the quality and production efficiency for the semiconductor package.

Chip carrier, semiconductor package and fabricating method thereof

A chip carrier for accommodating a passive component is proposed, allowing at least a chip to be electrically connected to the chip carrier. At least a pair of spaced-apart solder pads are formed on the chip carrier in no interference with the electrical connection between the chip and the chip carrier. A passive component is bonded at its two ends onto the solder pads by solder paste that electrically connects the passive component to the chip carrier. A recessed portion formed between the pair of the solder pads, is associated with a bottom surface of the passive component to form a passage, allowing a resin material for encapsulating the passive component or the chip to pass through and fill the passage, whereby the filled passage can prevent bridging of the solder paste and short circuit of the passive component from occurrence, thereby making yield of fabricated products desirably improved.

Chip carrier for accommodating passive component

A wire-bonded semiconductor device with an improved wire-arrangement scheme is proposed, which can help minimize abnormal wire sweep during encapsulation process. Among the bonding wires on the semiconductor device, those located in corners would be mostly susceptible to abnormal wire sweep, particularly a high-loop bonding wire that is located in immediate adjacency to a low-loop bonding wire located in one corner of the wire-bonded semiconductor device. To solve this problem, the low-loop bonding wire that is located in immediate adjacency to the sweep-susceptible high-loop bonding wire is erected substantially to the same loop height as the high-loop bonding wire, so that it can serve as a shield to the sweep-susceptible high-loop bonding wire against the flow of injected resin during encapsulation process, thus preventing abnormal wire sweep. Alternatively, if a pair of low-loop bonding wires are located in immediate adjacency to the sweep-susceptible high-loop bonding wire and are bonded to a common double-wire bond pad, these two low-loop bonding wires are arranged in an intercrossed manner, which can also help reduce the impact of the injected resin on the sweep-susceptible high-loop bonding wire, thus preventing abnormal wire sweep. The prevention of abnormal wire sweep allows the finished semiconductor device to be more assured in quality and reliability.

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Taichung, Taiwan

Yu-Ting Lai