Industrial Technology Research Institute

Epistar Corporation

Taiwan Semiconductor Manufacturing Comp. Ltd.

Au Optronics Corporation

Young Optics Inc.

Plume Design, Inc.

Yu-Ting Huang

Mean-Jue Tung

Hsin-Ying Wang

Tsun-Kai Ko

Chien-Kai Chung

Shi-Yuan Tong

De-Shan Kuo

Po-Shun Chiu

Shuo-Mao Chen

Ming-Da Yang

Wen-Song Ko

Yen-Ping Wang

Shinn-Zong Lin

Hsiang-Wei Lin

Woei-Cherng Shyu

Hung-Min Shih

Chun-Kuei Wen

Yi-Shan Lin

Li-Kou Chen

Hsiao-Jung Wang

Tze-Liang Lee

Kuan-Yu Chen

Yi-Hung Lin

Hsin-Hsin Shen

Chun-Hsiang Tu

Ming-Tsung Su

Hong-Ching Lin

Wei-Cheng Lo

Chun-Wen Wang

Meng-Jung Chuang

Wei-Lin Yu

Ying-Chieh Hung

Chun-Pin Wu

Victor Liu

Hsiang-Ming Huang

Ping-Feng Hsu

Li-Jiun Wang

Chun-Hung Liu

Sheng-Shin Lin

Tian-Hua Su

Wall mounted device

An electrostatic sensing system configured to sense an electrostatic information of a fluid inside a fluid distribution component and including an electrostatic sensing assembly, a signal amplifier and an analog-to-digital converter. The electrostatic sensing assembly includes a sensing component, and a shield. The sensing component is configured to be disposed at the fluid distribution component. The sensing component is disposed through the fluid distribution component so as to be partially located in the fluid distribution component. The shield surrounds a part of the sensing component that is located in the fluid distribution component. At least part of the shield is located on an upstream side of the sensing component. The signal amplifier is electrically connected to the sensing component. The analog-to-digital converter is electrically connected to the signal amplifier. The shield has an opening spaced apart from the sensing component.

Electrostatic sensing system and electrostatic sensing assembly

A heat dissipation device for a projector includes a light source, a light valve, a prism set, a shading element, and a projection lens. The light source emits a light beam. The light valve is disposed downstream of a light path of the light source to receive the light beam, convert a part of the light beam into image light and another part of the light beam into an ineffective light beam. The prism set includes at least one prism, receiving the image light and the ineffective light beam. The shading element includes a heat dissipation part and is disposed downstream of a light path of the prism set and used to block the ineffective light beam from the prism set. The projection lens is disposed downstream of the light path of the prism set.

Heat dissipation device for projector

A magnetic field structure is provided and includes: two magnetic poles disposed in a magnetic circuit path and opposite to one another to form a space therebetween for receiving an element to be tested; a magnetic field source for providing a magnetic field in the space; and an optical positioning element disposed in one of the two magnetic poles for optically positioning the element to be tested. Therefore, the magnetic field structure can simultaneously provide a strong magnetic field and a precise positioning function.

Magnetic field structure

The present disclosure provides a method for forming a semiconductor structure. In accordance with some embodiments, the method includes providing a substrate and a conductive feature formed over the substrate; forming a low-k dielectric layer over the conductive feature; forming a contact trench aligned with the conductive feature; and selectively growing a sealing layer which is a monolayer formed on sidewalls of the contact trench.

Semiconductor structure and method of making the same

An electrostatic detecting device adapted to an object. The electrostatic detecting device includes a substrate, a sensing electrode, a dielectric layer and a ground electrode. The substrate has a first surface and a second surface opposite to the first surface. The sensing electrode is disposed on the first surface and has a sensing surface. The sensing surface faces away from the first surface and configured to face the object. The dielectric layer having a dielectric constant greater than 1 is disposed on the second surface. The ground electrode is disposed apart from the sensing electrode by a spacing. The dielectric layer is disposed between the sensing electrode and the ground electrode.

Electrostatic detecting device

An electrostatic measuring method for an inner wall of a fluid pipeline includes a step of disposing a grounded metal plate to an outer wall of the fluid pipeline; a step of forming a grounding effect through the grounded metal plate and the outer wall, wherein the grounded metal plate has induced charges, the induced charges combine outer-wall existing charges on the outer wall to form total outer-wall charges, and the total outer-wall charges are related to charges to be measured on the inner wall of the fluid pipeline; and, a step of measuring an electrostatic voltage above the grounded metal plate so as to obtain the charges to be measured on the inner wall of the fluid pipeline. In addition, an electrostatic measuring system for inner wall of fluid pipeline is also provided.

Electrostatic measuring system for inner wall of fluid pipeline and measuring method thereof

A current detection device applied to a multi-core conducting wire comprises a carrier, magnetic sensors and a processor wherein the processor is connected to the magnetic sensors. The carrier has an accommodating channel for accommodating the multi-core conducting wire. The magnetic sensors are disposed at the carrier, surround the accommodating channel, equally share 360 degree of the peripheral of the accommodating channel, and are configured to measure an alternating magnetic field of the multi-core conducting wire to respectively obtain magnetic field measured values, wherein each of the magnetic sensors corresponds to a respective one of the magnetic field measured values. The processor stores a current decoupling model, and is configured to obtain the magnetic field measured values from the magnetic sensors and to calculate a current value of each core wire of the multi-core conducting wire according to the current decoupling model and the magnetic field measured values.

Current detection device and method

An electrostatic detecting system and an electrostatic detecting method for detecting the static electricity generated at an active surface of a substrate are provided. The electrostatic detecting system includes a sensing apparatus and a signal processing apparatus. The sensing apparatus is disposed at least adjacent to a back surface opposite to the active surface of the substrate, for measuring the static electricity generated at the active surface and generating an initial electric signal. The signal processing apparatus is electrically connected to the sensing apparatus, for receiving the initial electric signal and correcting the initial electric signal based on a voltage compensation value to obtain a final electric signal.

Electrostatic detecting system and method

A magnetic separator including a magnetic structure is provided. The magnetic structure includes magnetic structure units. The magnetic structure units form at least one continuous fluid channel. Each of the magnetic structure units has at least one protrusion. The magnetic structure has the protrusions facing towards each other between at least a portion of the adjacent two magnetic structure units.

Magnetic separator

A light-emitting device includes: a rectangular shape with a first side, a second side opposite to the first side, and a third side connecting the first side and the second side; a light-emitting stack, comprising a lower semiconductor layer, an upper semiconductor layer, and an active layer between the lower semiconductor layer and the upper semiconductor layer; a first electrode formed on the lower semiconductor layer, comprising a first electrode pad and a first extension electrode; a second electrode formed on the upper semiconductor layer, comprising a second electrode pad and a second extension electrode; and a first current blocking layer formed between the lower semiconductor layer and the first electrode pad, wherein the first current blocking layer comprises a top surface and side surfaces; wherein the first electrode pad covers the top surface and the side surfaces of the first current blocking layer and contacts the lower semiconductor layer.

Light-emitting device

A device includes a metal pad, and a passivation layer comprising portions overlapping edge portions of the metal pad. The metal pad and the passivation layer are in a chip. A solder region is over the passivation layer. A metallic feature electrically inter-couples the metal pad and the solder region, and the metallic feature includes a continuous metal region. A polymer layer includes an upper portion over the metallic feature, and a lower portion penetrating through the continuous metal region.

Method of forming metal pads with openings in integrated circuits including forming a polymer extending into a metal pad

A light-emitting device is provided. The light-emitting device comprises a substrate; a semiconductor stack on the substrate comprising a first region and a second region; a first trench extending from the semiconductor stack to the substrate to expose a surface of the substrate and separating the first region from the second region; and a first electrode comprising a first pad on the first region and a first extending electrode connecting to the first pad, wherein the first extending electrode is across the first trench.

Light-emitting device and method of manufacturing thereof

A light-emitting device includes: a rectangular shape with a 1side, a 2side opposite to the 1side, and a 3side connecting the 1and the 2sides; a first electrode pad formed adjacent to the 3side; a second electrode pad formed adjacent to the 2side; a first extension electrode, extending from the first electrode pad in a direction away from the 3side and bended toward the 2side; and a second extension electrode, including a first and a second branches respectively extending from the second electrode pad; wherein a distance between the first electrode pad and the 3side is smaller than a distance between the second electrode pad and the 3side; wherein an end portion of the first branch includes a first arc bending to the 3side and a minimum distance between the first branch and the 1side is smaller than a minimum distance between the second branch and the 1side.

Growing community of inventors

Hsinchu, Taiwan

Yu-Ting Huang