Cooler Master Technology Inc.

Cooler Master Co., Ltd.

Cooler Master Development Corporation

Yu-Te Wei

Wei-Lung Chan

Shui-Fa Tsai

Tsung-Wei Lin

Ying-Chun Chen

Chang-Han Tsai

Ling She

Pei-Chiang Lin

Di Han Wu

Wei-lung Chan

A computer includes a casing, an electronic assembly, and a water cooling assembly. The casing, forms an accommodation space. The casing has an interior fluid channel located at at least one side of the casing, and a fluid inlet and a fluid outlet which are in fluid communication with the interior fluid channel. The electronic assembly is located in the accommodation space. The water cooling assembly includes a first water block and a radiator. The first water block is in thermal contact with the electronic assembly, the first water block, the radiator, and the interior fluid channel located at the at least one side of the casing are in fluid communication with each other so as to form a circulation channel, and the fluid inlet and the fluid outlet of the casing are respectively in fluid communication with the radiator and the first water block.

Computer device, casing, and water cooling heat dissipation device

A pressurized infusion device and a liquid cooling system are disclosed. The pressurized infusion device includes a liquid storage tank and a pump. The liquid storage tank has a first end and a second end opposite to the first end. The first end has a first connecting structure, and the second end has a second connecting structure. The pump is connected with the first end of the liquid storage tank and has a third connecting structure, a first connecting port, a second connecting port, a third connecting port and a fourth connecting port. The third connecting structure corresponds to the first connecting structure. A pump flow channel from the first connecting port to the second connecting port is formed inside the pump, and a bypass flow channel from the third connecting port to the fourth connecting port is also formed inside the pump.

Pressurized infusion device and liquid cooling system

A liquid cooling device includes body. The body has liquid inlet and liquid outlet. The liquid outlet has first internal thread on its inner wall. The liquid inlet has second internal thread on its inner wall. Another liquid cooling device has body, first thread adapter and second thread adapter. The first thread adapter is movably disposed on the liquid outlet, and has a first internal thread on its inner wall. The second thread adapter is movably disposed on the liquid inlet, and has a second internal thread on its inner wall. Still another liquid cooling device has a body. The body has a liquid passage. The liquid passage has internal thread on its inner wall. Yet another liquid cooling device has body and thread adapter. The body has a liquid passage. The thread adapter is movably disposed on the liquid passage, and has internal thread on its inner wall.

Liquid cooling device

This disclosure provides a heat dissipation device configured to be in thermal contact with a heat source of a circuit board and including a main body part and an engagement assembly. The main body part includes a thermally conductive component and at least one fin assembly. The thermally conductive component is configured to be in thermal contact with the heat source, and the at least one fin assembly is thermally coupled to the thermally conductive component. The engagement assembly includes at least one first cover and at least one fastener. The at least one first cover presses against a side of the at least one fin assembly that is located away from the heat source. The at least one fastener is disposed through the at least one first cover and the at least one fin assembly and is configured to be fixed to the circuit board.

Heat dissipation device

A heat sink and its manufacturing method. The heat sink includes a base and plural heat pipes. The base has a first surface, plural parallel heated areas concavely formed on the first surface, a protrusion disposed between any two heated areas and protruding in a direction towards the first surface, and at least one notch formed on each protrusion. A first protrusion portion and a second protrusion portion are formed at the top of the protrusion and the top of notch respectively. The heat pipes are embedded into the heated areas respectively in the lengthwise direction, and the heat pipes at the notches of the protrusions are attached and in contact with each other. The notch of each heat pipe may be compressed and deformed, so that the heat pipes are in contact with each other.

Heat sink and manufacturing method thereof

A heat sink assembly and a fan and a fan module thereof, the heat sink assembly includes a heat sink (), a heat sink rack and a fan module. The fan module includes a fan rack () and a fan (). The heat sink rack is installed on the heat sink (). The heat sink rack includes a first sliding portion (), and the fan rack () or the fan () includes a second sliding portion (). The first sliding portion () is configured corresponding to the first sliding portion () with a slidable cooperation in order to allow the fan rack () or the fan () to use the cooperation between the first sliding portion () and the second sliding portion () to slide in a predefined direction.

Heat sink assembly and fan and fan module thereof

A housing of an active component, which is used to install an active source, includes a main portion and at least two fixing portions. The main portion has side walls. The active source is installed on the main portion. The Young's modulus of the material making the fixing portion is different from the Young's modulus of the material making the main portion. The fixing portion is formed with fixing holes, and is connected to the side wall of the main portion. It therefore provides better effects of shock proofing and shock isolation without unnecessary noise, and prevents a fixing element fixing the active component from being loosened, with enhanced stability of the active component. The present invention also provides a manufacturing method for housing of the active component.

Housing of active element and manufacturing method thereof

A back plate includes flat polygonal shaped body and locking assembly located at bottom surface of the flat polygonal shaped body. The locking assembly includes pivotal member, connecting member and protruding portion with connecting hole and locking hole. The connecting hole is located at a side of the locking hole. The locking hole is a curved hole with the connecting hole as a center. The pivotal member has hinge hole hinged with the connecting hole and a fixing hole matching with the locking hole, and the fixing hole is movable with respect to the locking hole with the hinge hole as a center. The connecting member is disposed through the fixing hole and the locking hole, and is connected to the seat. The connecting member is movable in the locking hole in order to make the fixing hole to move with respect to the locking hole.

Back plate and motherboard having the same

A fan includes a fan frame and a fan wheel. The fan frame includes a frame body and at least two vibration-proof members. The frame body has at least two positioning ribs, wherein the at least two positioning ribs protrude from a side wall of the frame body and are distributed symmetrically. Each of the vibration-proof members has a positioning groove. The positioning rib of the frame body is capable of being embedded in the positioning groove of the vibration-proof member so as to position the vibration-proof member on the side wall of the frame body. The fan wheel is rotatably disposed in the fan frame.

Growing community of inventors

Taipei, Taiwan

Yu-Te Wei