Asm Technology Singapore Pte Ltd

Asm Assembly Automation Limited

Asmpt Singapore Pte. Ltd.

Yu Sze Cheung

Chi Wah Cheng

Kai Fung Lau

Shing Kai Yip

Hing Suen Siu

Yan Yiu Lam

Yiu Ming Cheung

Pei Wei Tsai

Chung Yan Lau

Chi Fung Chan

Hon Kam Ng

Chi Hung Leung

Chun Shing Yip

Man Yin Kwan

A test handler comprising a primary rotary turret comprising pick heads for transporting electronic components, and a secondary rotary turret arranged and configured to receive electronic components directly or indirectly from the primary rotary turret, the secondary rotary turret including multiple separate test sectors having component carriers for carrying the electronic components received from the primary rotary turret, wherein the multiple test sectors are rotatably movable relative to one another. The test handler also comprises at least one testing device positioned along a periphery of the secondary rotary turret, wherein the component carriers of the respective test sectors are operative to convey the electronic components to a position of the at least one testing device for testing.

Test handler having multiple testing sectors

A testing apparatus and a method for testing electronic devices is provided. The apparatus comprising a plurality of detachably mountable test stations which are operative to perform tests on the electronic devices and a plurality of pick heads for conveying the electronic devices to at least one of the plurality of test stations for testing. The apparatus further comprises an identification element incorporated in each test station indicating a characteristic of the test station, and an identification element detector movable relative to the plurality of test stations, the identification element detector being operative to identify and authenticate the characteristic of the at least one test station by detecting the identification element incorporated in the test station, prior to utilizing the test station for testing the electronic devices.

Apparatus and method for authentication of electronic device test stations

An apparatus and a method for inspecting a substantially transparent semiconductor device are provided, where the method comprises the steps of holding the substantially transparent semiconductor device with a semiconductor device holder, and illuminating a surface of the semiconductor device held by the semiconductor device holder from multiple directions with an enveloping light source. Thereafter, capturing a first image of the semiconductor device with an imaging module from the light projected from the enveloping light source, the first image revealing a direction of grinding marks on the said surface of the transparent semiconductor device. Then, relatively aligning the semiconductor device and an adjustable light source based on the direction of the grinding marks, and projecting light from the adjustable light source onto the surface of the semiconductor device at an oblique angle relative to the surface of the semiconductor device in a projection direction, such projection direction being substantially perpendicular to the direction of the grinding marks.

Apparatus and method for inspecting substantially transparent electronic devices

A method for automated alignment between a plurality of electronic components and at least one testing device for receiving the electronic components for testing which includes defining a fiducial marker and positioning a moveable imaging device relative to a stationary imaging device, such that the fiducial marker is within a field of view of the moveable imaging device and within a field of view of the stationary imaging device. The moveable imaging device determines, with respect to each of the at least one testing device, a first offset between the testing device and the fidicual marker. The stationary imaging device determines, with respect to each electronic component, a second offset between the electronic component and the fidicual marker. Alignment is effected between each electronic component and the testing device in accordance with the first and second offsets.

Method and apparatus for aligning electronic components

A method for aligning probe pins with respect to positions of electronic devices comprises conducting contact stamping on a first electronic device with the probe pins to form first probe marks on lead pads of the first electronic device, capturing an image of the first electronic device, determining positions of the first probe marks on the first electronic device using the captured image, calculating an offset using the positions of the first probe marks, adjusting relative positions between a subsequent plurality of electronic devices and the probe pins using the offset, and contacting lead pads of the subsequent plurality of electronic devices with the probe pins for testing said electronic devices. The first probe marks are configured to have greater visibility as compared with second probe marks formed when contacting the lead pads of the subsequent plurality of electronic devices with the probe pins, so as to improve the accuracy of the offset calculated.

Method and apparatus for aligning probe pins with respect to positions of electronic devices

Disclosed are an electrical contact for contacting an electrical component, an apparatus for testing an electrical component and a method of assembling an apparatus comprising an electrical contact for testing an electrical component. The electrical contact comprises a first member longitudinally extending and having an end, said first member having a first longitudinal side and a second longitudinal side; a second member having a first segment extending longitudinally adjacent to the first longitudinal side of the first member, a second segment extending longitudinally adjacent to the second longitudinal side of the first member, and a third segment extending substantially transverse to the first member and located adjacent to the end of the first member, the third segment being provided to couple the first segment to the second segment; wherein a continuous channel is defined between the first member and the second member such that the first member and the second member are electrically isolated from each other.

Electrical contact having electrical isolated members for contacting an electrical component

Disclosed is an apparatus for handling electronic components and a method of adjusting the position of at least one handling device of an apparatus for handling electronic components. The apparatus comprises a rotary device; an imaging device located on the rotary device which is positionable by the rotary device; a plurality of pick heads arranged circumferentially around the rotary device, each pick head being operable to hold an electronic component; a fiducial mark located at a fixed position relative to the rotary device such that the rotary device is rotatable relative to the fiducial mark, the fixed position of the fiducial mark being indicative of an arrangement of an electronic component which is held by a respective pick head; and at least one handling device for handling the electronic components, the position of the at least one handling device being adjustable for aligning the at least one handling device with the arrangement of the electronic component held by the pick head; wherein the imaging device is operative to capture at least one image comprising the fiducial mark and the at least one handling device for deriving an offset between the at least one handling device and the arrangement of the electronic component as indicated by the fixed position of the fiducial mark.

Apparatus and method for adjustment of a handling device for handling electronic components

An apparatus for securing electronic devices on a carrier for storing electronic devices during transportation of the electronic devices on the carrier has a guiding track for guiding motion of the carrier when the carrier receives electronic devices. A magnetic track located adjacent to the guiding track attracts the electronic devices onto the carrier with a magnetic attraction force. In particular, the magnetic track has a support surface facing the carrier that has a smaller width than a width of a portion of the magnetic track that is spaced from the support surface.

Apparatus for securing electronic devices on a carrier during transportation

A feeding apparatus for supplying electronic devices for pick-up comprises a guide track for guiding and feeding a plurality of electronic devices and a separator operative to receive electronic devices from the guide track for the electronic devices to be picked up from the separator. A protrusion is located on either of the guide track or the separator, and a cavity is located on the other of the guide track or the separator for receiving the protrusion. The protrusion and the cavity cooperate to form a substantially continuous surface for transferring the electronic devices to the separator.

Electronic device separator for a feeding apparatus

A test handler comprises a main rotary turret and a loading station operative to convey electronic components to functional modules of the main rotary turret. An auxiliary rotary turret incorporating multiple carrier modules then receives electronic components from the functional modules of the main rotary turret. Multiple testing stations located along a periphery of the auxiliary turret are operative to receive electronic components from the carrier modules for testing while the loading station is concurrently conveying electronic components to the functional modules of the main rotary turret, so that the impact of transfer time is reduced or eliminated in a test process cycle of the test handler.

High throughput test handler system

An apparatus for conveying electronic devices comprises a track for conveying a plurality of electronic devices in a row towards a pick-up position on the track where the electronic devices are removed by a pick-up device. A guiding portion located over the track has a first restraining mechanism formed in the guiding portion that is operative to restrain and secure a first electronic device at a first position next to the pick-up position and a second restraining mechanism formed in the guiding portion that is operative to restrain and secure a second electronic device at a second position away from the pick-up position which is immediately subsequent to the first position. The first and second electronic devices are configured to be released and conveyed towards the pick-up position when the first and second restraining mechanisms respectively are deactivated. A corresponding method is also provided.

Apparatus and method for transferring electronic devices

For aligning an electronic component to a required orientation, the electronic component is picked up and it is inspected while it is being held to determine its initial orientation. A pr&#xe9;cising mechanism is then rotated to correspond to the initial orientation of the electronic component. After the electronic component is secured on the pr&#xe9;cising mechanism in the initial orientation, the pr&#xe9;cising mechanism is rotated to align the electronic component to the required orientation. Thereafter, the electronic component that has been aligned to the required orientation may be picked up for further testing and/or processing.

Method for aligning electronic components

Disclosed is an apparatus for handling electronic components. The apparatus comprises: i) a rotary device and a plurality of pick heads arranged circumferentially around the rotary device, each pick head being operable to hold an electronic component; ii) a position-determining device for determining an arrangement of the electronic components as held by the respective pick heads; iii) a fiducial mark arranged in a position that is indicative of the arrangement of the electronic components, as determined by the position-determining device; iv) a first imaging device arranged relative to the fiducial mark; and v) at least one handling device for handling the electronic components. Specifically, the first imaging device is operable to capture at least one image comprising the fiducial mark and the at least one handling device so that a position of the at least one handling device is adjustable to align the at least one handling device with respect to the arrangement of the electronic components, based on an offset between the fiducial mark and the at least one handling device as derived from the at least one image captured by the first imaging device. A method of adjusting the position of at least one handling device of an apparatus for handling electronic components is also disclosed.

Apparatus and method of using an imaging device for adjustment of at least one handling device for handling semiconductor components

A testing apparatus for electronic components comprises a mounting block and a plurality of contact strips arranged on the mounting block. The contact strips are configured such that electrical leads of an electronic component are operative to press against and bend the contact strips in a biasing direction to ensure good contact between the electrical leads and the contact strips during testing of the electronic component. Further, a preload block located on the mounting block is operative to contact and apply a pre-stress force onto the contact strips in the biasing direction prior to contact between the electrical leads and the contact strips.

Test contactor for electrical testing of electronic components

This invention relates to a method and apparatus for pick and place handling of electronic components that have been formed on a common substrate and then separated on a cutting chuck. A transferring means is provided formed with openings for receiving separated components. The opening is defined by walls of which at least one is movable so as to engage the components and hold them in a fixed configuration and orientation while they are moved by a sliding motion through a processing unit and onto a transfer platform for delivery to an output track.

Growing community of inventors

Hong Kong, China

Yu Sze Cheung