Foxsemicon Integrated Technology, Inc.

Yu-Shu Chen

Chih-Ming Lai

Zheng-Jay Huang

Ying-Chieh Lu

Hsin-Fei Huang

Shan-Ju Lin

Kuo-Feng Chiang

Ping-Yu Chen

Chien-Ting Lu

Kuo-Mang Lo

An-Chi Wei

Hsueh-Chen Chang

Ming-Chin Chien

Ji-Min Lo

A LED package includes a substrate, at least one LED chip, a transparent adhesive and a lens. The at least one LED chip is mounted on the substrate. The transparent adhesive is filled between the LED chip and the lens. A number of through holes is regularly defined in an optical non-effective portion of the lens. The through holes are configured for increasing the air convection between inside and outside of the lens.

LED package

A light source holder includes a spherical surface and a number of recessed portions. The recessed portions are defined in the spherical surface and arranged substantially evenly over the spherical surface. Each of the recessed portions comprises a plurality of inner surfaces. The inner surface of each recessed portion comprises a bottom surface and a lateral reflective surface. The bottom surface is capable of having a solid-state light source arranged thereon. The lateral reflective surface is adjacent to the bottom surface and configured for reflecting light emitted from the solid-state light source and outputting the light from the recessed portion.

Growing community of inventors

Miao-Li Hsien, Taiwan

Yu-Shu Chen