Industrial Technology Research Institute

Yu-Shih Su

Shih-Chieh Chang

Chiao-Ling Lung

Yiyu Shi

A fault-tolerant unit and a fault-tolerant method for through-silicon via (TSV) are provided. The fault-tolerant unit includes TSV structures TSV&#x2dc;TSVn, nodes N&#x2dc;N, nodes N&#x2dc;Nand a switching module. The TSV structure TSVi is connected between the node Nof the first chip and the node Nof the second chip, wherein 1&#x2266;i&#x2266;n. The switching module is connected between the nodes N&#x2dc;Nof the second chip and a test path of the second chip. In normal operation state, the switching module disconnects the test path and the nodes N&#x2dc;Nwhen the TSV structures TSV&#x2dc;TSVn are valid. The switching module connects the node Nto at least another one of the nodes N&#x2dc;Nwhen the TSV structure TSVi is faulty in the normal operation state. In test status, the switching module connects the test path to the nodes N&#x2dc;N.

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Yunlin County, Taiwan

Yu-Shih Su