International Business Machines Corporation

Yu-Shiang Lin

Joel Abraham Silberman

Jae-Joon Kim

Chung-Hsun Lin

Liang-Teck Pang

Shih-Hsien Lo

Insup Shin

In one aspect, a method for forming an electronic device includes the following steps. An ETSOI layer of an ETSOI wafer is patterned into one or more ETSOI segments each of the ETSOI segments having a width of from about 3 nm to about 20 nm. A gate electrode is formed over a portion of the one or more ETSOI segments which serves as a channel region of a transistor, wherein portions of the one or more ETSOI segments extending out from under the gate electrode serve as source and drain regions of the transistor. At least one TSV is formed in the ETSOI wafer adjacent to the transistor. An electronic device is also provided.

Hybrid ETSOI structure to minimize noise coupling from TSV

Systems and methods for error recovery include determining an error in at least one stage of a plurality of stages during a first cycle on a hardware circuit, each of the plurality of stages having a main latch and a shadow latch. A first signal is transmitted to an output stage of the at least one stage to stall the main latch and the shadow latch of the output stage during a second cycle. A second signal is transmitted to an input stage of the at least one stage to stall the main latch of the input stage during the second cycle and to stall the main latch and the shadow latch of the input stage during a third cycle. Data is restored from the shadow latch to the main latch for the at least one stage and the input stage to recover from the error.

Pulsed-latch based razor with 1-cycle error recovery scheme

Hybrid extremely thin silicon-on-insulator (ETSOI) structure to minimize noise coupling from TSV

There is provided an alternating current supply noise reducer for a 3D chip stack having two or more strata. Each of the strata has a respective one of a plurality of power distribution circuits and a respective one of a plurality of clock distribution circuits arranged thereon. The alternating current supply noise reducer includes a plurality of voltage droop sensors and a plurality of skew adjustors. The plurality of voltage droop sensors is for detecting alternating current supply noise in the plurality of power distribution circuits. One or more voltage droop sensors are respectively arranged on at least some of the strata. The plurality of skew adjusters are for delaying one or more clock signals provided by the plurality of clock distribution circuits responsive to an amount of the alternating current supply noise. Each skew adjuster is respectively arranged on the at least some of the strata.

AC supply noise reduction in a 3D stack with voltage sensing and clock shifting

There is provided a clock distribution network for synchronizing global clock signals within a 3D chip stack having two or more strata. The clock distribution network includes a plurality of clock distribution circuits, each being arranged on a respective one of the two or more strata for providing the global clock signals to various chip locations. Each of the plurality of clock distribution circuits includes a resonant circuit for providing stratum-to-stratum coupling for the clock distribution network. The resonant circuit includes at least one capacitor and at least one inductor.

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Elmsford, NY, United States of America

Yu-Shiang Lin