TSMC Solid State Lighting Ltd.

Taiwan Semiconductor Manufacturing Comp. Ltd.

Epistar Corporation

Lite-on Technology Corporation

Silitek Electronic (guangzhou) Co., Ltd.

Yu-Sheng Tang

Hsin-Hung Chen

Ching-Yi Chen

Hao-Yu Yang

Hsiao-Wen Lee

Tzu-Wen Shih

Cheng-Lin Huang

Kuo-Chio Liu

Fu-Chen Chang

Wen-Ming Chen

Chun-Yen Lo

Shang-Yu Tsai

Hao-Wei Ku

Ru-Shi Liu

Chung Yu Wang

Chi-Xiang Tseng

Tien-Ming Lin

Sheng-Shin Guo

Chi Xiang Tseng

Jung-Tang Chu

Shu-Fen Hu

Yi-Tsuo Wu

Chyi Shyuan Chern

Chien-Yuan Wang

Hsin-Hsien Wu

Hung-Yuan Su

Tien-Min Lin

Fu-Wen Liu

Huai-En Lai

Cheng-Wen Tsai

A method for sawing a semiconductor wafer is provided. The method includes sawing the semiconductor wafer with a first dicing blade to form a first opening. The semiconductor wafer includes a dicing tape and a substrate attached to the dicing tape. The first opening is formed in the upper portion of the substrate. The method also includes sawing the semiconductor wafer with a second dicing blade from the first opening to form a second opening under the first opening and in the middle portion of the substrate. The method further includes sawing the semiconductor wafer with a third dicing blade from the second opening to form a third opening under the second opening and penetrating the lower portion of the substrate, so that the semiconductor wafer is divided into two dies. The first dicing blade, the second dicing blade, and the third dicing blade have different widths.

Method for forming semiconductor die having edge with multiple gradients

A method for sawing a semiconductor wafer is provided. The method includes sawing a semiconductor wafer to form a first opening. In addition, the semiconductor wafer includes a dicing tape and a substrate attached to the dicing tape by a die attach film (DAF), and the first opening is formed in an upper portion of the substrate. The method further includes sawing through the substrate and the DAF of the semiconductor wafer from the first opening to form a middle opening under the first opening and a second opening under the middle opening, so that the semiconductor wafer is divided into two dies. In addition, a slope of a sidewall of the middle opening is different from slopes of sidewalls of the first opening and the second opening.

Semiconductor die having edge with multiple gradients and method for forming the same

A lighting apparatus includes a substrate, a plurality of light-emitting dies disposed on the substrate and spaced apart from one another, a continuous structure disposed over the substrate and covering the light-emitting dies within, and a filler. The light-emitting dies each are covered with an individual phosphor coating and the filler is between the continuous structure and the phosphor coating for each of the light-emitting dies. The lighting apparatus has a substantially white appearance when the plurality of light-emitting dies is turned off.

Lighting apparatus

A lens is formed over one or more light-emitting devices disposed over a substrate. The lens includes a trench that circumferentially surrounds the one or more light-emitting devices. The trench is filled with a phosphor-containing material.

Batwing LED with remote phosphor configuration

An optical emitter is fabricated by bonding a Light-Emitting Diode (LED) die to a package wafer, electrically connecting the LED die and the package wafer, forming a phosphor coating over the LED die on the package wafer, molding a lens over the LED die on the package wafer, molding a reflector on the package wafer, and dicing the wafer into at least one optical emitter.

Wafer level reflector for LED packaging

A lighting apparatus includes a substrate, a plurality of light-emitting dies, a continuous encapsulation structure, and a gel. The plurality of light-emitting dies are disposed on the substrate and spaced apart from one another. The light-emitting dies each are covered with a respective individual phosphor coating conformally. The continuous encapsulation structure has a curved surface disposed over the substrate and encapsulates the light-emitting dies within. The gel is disposed between the encapsulation structure and the phosphor coating for each of the light-emitting dies. The gel contains diffuser particles. The lighting apparatus has a substantially white appearance in an off state when the plurality of light-emitting dies is turned off.

LED emitter with improved white color appearance

Two or more molded ellipsoid lenses are formed on a packaged LED die by injecting a glue material into a mold over the LED die and curing the glue material. After curing, the refractive index of the lens in contact with the LED die is greater than the refractive index of the lens not directly contacting the LED die. At least one phosphor material is incorporated into the glue material for at least one of the lenses not directly contacting the LED die. The lens directly contacting the LED die may also include one or more phosphor material. A high refractive index coating may be applied between the LED die and the lens.

Refractive index tuning of wafer level package LEDs

A lighting apparatus includes a substrate. One or more light-emitting devices are disposed over the substrate. A lens is molded over the substrate and over the one or more light-emitting devices. A recess is disposed in the lens. The recess circumferentially surrounds the one or more light-emitting devices in a top view. The recess is at least partially filled with phosphor particles.

A light-emitting diode (LED) package system includes a LED disposed over a surface of a substrate. A molding material covers the LED. A phosphor-containing material is disposed over and spaced from the LED by the molding material.

Light-emitting diode (LED) package systems and methods of making the same

A semiconductor structure includes a module with a plurality of die regions, a plurality of light-emitting devices disposed upon the substrate so that each of the die regions includes one of the light-emitting devices, and a lens board over the module and adhered to the substrate with glue. The lens board includes a plurality of microlenses each corresponding to one of the die regions, and at each one of the die regions the glue provides an air-tight encapsulation of one of the light-emitting devices by a respective one of the microlenses. Further, phosphor is included as a part of the lens board.

An embodiment of the disclosure includes a LED module. A substrate is provided. A light sensor is positioned in the substrate. A LED chip is attached to the substrate. The LED chip has a first side and a second side. The second side is covered by an opaque layer with an opening. The opening is substantially aligned with the light sensor. The light sensor receives a light output emitting from the LED chip through the opening.

Light-emitting diode (LED) module with light sensor configurations for optical feedback

An LED emitter uses a molded lens with phosphor material embedded in a circumferential trench to generate a batwing beam pattern. After the lens is molded over a package substrate with connected LED dies thereon, the phosphor material is molded, injected, or dispensed into a circumferential trench. The molded lens is shaped such that a majority of the light emitted by the one or more LED dies is reflected by the top surface to the side surfaces through the phosphor material.

Growing community of inventors

Qishan Township, Taiwan

Yu-Sheng Tang