Hon Hai Precision Industry Co., Ltd.

Icf Technology Limited

Yu-Ning Wang

Ching-Yu Chou

Cheng-Kuo Lee

Chen-Ching Chu

Chen-Hsing Cheng

Jih-Jenn Huang

Stephen Ko-Chiang Chien

Yi-Ming Liao

A protective case for an electronic device includes a PCB and other components and devices. The other components and devices arranged on the case are connected to the PCB, the devices include a battery, a socket configured to accommodate a wireless communication device, a data connector, a wireless communication module, and a control module. The control module controls the battery to charge the electronic device and activates the wireless communication module to connect to the electronic device through the data connector, if the data connector is in use. The wireless communication module is controlled to communicate with the wireless communication device if the wireless communication device is removed from the socket and the battery is controlled to supply power to the wireless communication device if the wireless communication device is inserted into the socket.

Protective case with electronic function for electronic device

A protection case for protecting an electronic device includes a cover body shaped to receive and hold to the electronic device. A cable winding apparatus is arranged adjacent the cover body and includes a wheel rotatably arranged adjacent the cover body, and a pivot protruding from a center of the wheel and configured to wind a cable of an earphone. A through hole is arranged on a side wall of the pivot and configured to permit a first end of the earphone, which connects to a jack, to pass through.

Protection case for electronic device

A method for manufacturing a patterned thin-film layer includes the steps of: providing a substrate with a plurality of banks thereon, the plurality of banks defining a plurality of spaces; providing an ink-jet device comprising a plurality of nozzles for depositing ink therefrom; generating a jetting information about ink volume that each of the nozzles deposits into the respective spaces by a random method, the jetting information meeting ink volume deposited into each of the spaces is in a range from about 92.5% to about 107.5% of an average volume of ink in the spaces; making the nozzles to deposit ink into the respective spaces according to the jetting information; and solidifying the ink so as to form a plurality of patterned thin-film layers formed in the spaces.

Method for manufacturing patterned thin-film layer

A method for manufacturing a patterned thin-film layer according to one preferred embodiment includes the steps of: providing a substrate with a plurality of banks thereon, the plurality of banks defining a plurality of spaces therein for receiving ink therein, each of the banks having a top surface and a plurality of side surfaces adjacent to the top surface; irradiating the plurality of banks with UV light beams, wherein the UV light beams are obliquely incident on the top surfaces of the substrate such that a surface wettability of the ink on the top surfaces is lower than that of the side surfaces of the banks; applying ink into the spaces; and curing the ink so as to form a patterned thin-film layer on the substrate.

An ink-jet device () is provided. The ink-jet device includes an ink reservoir (), a print head (), and a carry-in pipe () connected between the ink reservoir and the print head. The ink-jet device further includes an air outlet pipe () and a balance pipe (). The air outlet pipe is connected with the print head and intercommunicates with the atmosphere. The balance pipe is connected between the carry-in pipe and the air outlet pipe. A method for eliminating air bubbles in print head is also provided.

Ink-jet device and method for depositing ink using the same

A substrate structure includes a substrate, a number of banks formed on the substrate, and a patterned layer. The banks and the substrate cooperatively define a number of accommodating rooms. The accommodating rooms are configured for accommodating ink. The patterned layer covers the bank between at least two adjacent accommodating rooms.

Substrate structure with patterned layer

A method for manufacturing a patterned layer () on a substrate () includes the following steps: providing a substrate having a plurality of banks () formed thereon, the substrate and the banks cooperatively defining a plurality of accommodating spaces (), wherein each of the accommodating spaces has a first edge () and a second edge () parallel to the first edge, a distance between the first edge and the second edge is b; the first nozzle () moving along a first path (), and the first path is parallel to the first edge, a distance between the first path and the first edge is a; the first nozzle jetting ink into the accommodating space; the second nozzle () moving along a second path (), a distance between the first path and the second path is c, and the distance c satisfies one of the two equations: 0&#x3c;c&#x3c;b&#x2212;a, and 0&#x3c;c&#x3c;a.

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Hsinchu, Taiwan

Yu-Ning Wang