Toshiba Kikai Kabushiki Kaisha

Yu Murofushi

Isao Matsuzuki

Ryuji Tanaka

Yoshihiro Yamamoto

Hiroaki Omagari

Masateru Tomiyasu

Shigeru Fujiwara

Mitsunori Kokubo

Takato Baba

Yuki Sugiura

Hidetoshi Kitahara

Toru Suzuki

The polishing apparatus includes: a holding section that holds a material to be polished; the polishing body that polishes the material to be polished held by the holding section; the head that supports the polishing body via the elastic mechanism; a driving mechanism that causes the head to be moved in a Z coordinate direction; and a control unit that is connected to the driving mechanism and controls the driving mechanism. A load measurement device to measure a load applied to the polishing body is attached to the head, and the load measurement device is connected to the polishing body via the elastic mechanism.

Grinding tool

A polishing apparatus includes: a holding section that holds a material to be polished; a polishing body that polishes the material to be polished held by the holding section; a head that supports the polishing body via an elastic mechanism; a driving mechanism that causes the head to be moved in a Z coordinate direction; a control unit that controls the driving mechanism; and a position sensor that measures a position of the polishing body with respect to the head. The load control is performed based on a measurement value of the position sensor and a spring constant value of the elastic mechanism.

Polishing apparatus

A shape forming system according to one embodiment includes a mold assemblies; a heating unit; a pressing unit; a cooling unit; an isolation chamber configured to accommodate therein the heating unit, the pressing unit, and the cooling unit arranged in parallel with each other; and a conveyance unit configured to move the plurality of mold assemblies each of which is arranged on a plate provided in each of the heating unit, the pressing unit, and the cooling unit to thereby convey the mold assemblies in sequence.

Shape forming system and shape forming method

A transfer device that transfers a fine transfer pattern formed on a master mold to a molded material, includes a first transfer unit that transfers the fine transfer pattern formed on the master mold to a replica mold made from a material that transmits light; and a second transfer unit that transfers a fine transfer pattern formed on the replica mold by the first transfer unit to the molded material.

Transfer device, molded material and transfer method

Growing community of inventors

Numazu, Japan

Yu Murofushi