Dowa Electronics Materials Co., Ltd.

Olympus Corporation

Yu Murano

Hidefumi Fujita

Daisuke Itoh

Shuji Yamashita

Hiroaki Kasai

Shinichi Konno

Takeshi Deguchi

Kohei Shiramizu

Takuya Fujihara

Daiki Yoshihara

This adhesion prevention film for medical devices is a single-layer or multilayer adhesion prevention film that is formed on the surface of a medical device. This adhesion prevention film for medical devices comprises an outermost layer that contains a plurality of conductive particles and a resin having a continuously usable temperature of 200&#xb0; C. or higher. The surface of the outermost layer is provided with recesses and projections by having parts of the plurality of conductive particles exposed from the resin.

Adhesion prevention film for medical devices and medical device

In a fine silver particle dispersing solution wherein 30 to 75% by weight of fine silver particles, which are coated with an organic acid having a carbon number of 5 to 8 or a derivative thereof and which have an average particle diameter of 1 to 100 nm, are dispersed in a water-based dispersion medium which is a solvent containing water as a main component, the fine silver particle dispersing solution containing ammonia and nitric acid, there is added 0.15 to 0.6% by weight of a surface regulating agent, which preferably contains a polyether-modified polydimethylsiloxane and a polyoxyethylene alkyl ether or a polyether, or 0.005 to 0.6% by weight of an antifoaming agent which is preferably a silicone antifoaming agent.

Fine silver particle dispersing solution

A silver particle dispersing solution, which contains 50-70% by weight of silver particles having an average particle diameter of 20 nm or less, is applied on a substrate by the flexographic printing, and then, calcined to produce a booster antenna wherein a silver conductive film, which contains 10-50% by volume of a sintered body of the silver particles and which has a volume resistivity of 3-100 &#x3bc;&#x3a9;&#xb7;cm, a surface resistivity of 0.5&#x3a9;/&#x25a1; or less and a thickness of 1-6 &#x3bc;m, is formed on the substrate. Thus, there is provided a booster antenna which has excellent electrical characteristics and flexibility and which can be inexpensively mass-produced.

Booster antenna and method for producing same

Growing community of inventors

Tokyo, Japan

Yu Murano