Dell Products Inc.

Taiwan Semiconductor Manufacturing Comp. Ltd.

Dell & Products L.p.

Yu-Ming Kuo

Qinghong He

Derric Christopher Hobbs

Chih-Lung Cheng

Chung-An Lin

Yan-Zih Chen

Chih-Yung Yang

Li-Ming Hsu

Ching-Hsiang Yang

Yi-Chang Yeh

In one or more embodiments, an information handling system may include: at least one processor; a memory medium, communicatively coupled to the at least one processor, that stores an operating system and at least one application executable by the at least one processor; a chassis; an information handling system card port communicatively coupled to the at least one processor; a support device fastened to the chassis; and an expansion card coupled to the information handling system card port and fastened to the support device. In one or more embodiments, the support device may include an opening that permits air to pass through. In one or more embodiments, the support device may include a cover configured to obscure airflow through the opening of the support device. For example, the cover may be configured to unroll to obscure airflow through the opening of the support device.

Support device for an expansion card of an information handling system

An information handling system includes a hardware processor, a memory device, and a PMU to provide power to the hardware processor and memory device. A TEC chip refrigeration liquid cooling system to cool a heat-generating component device includes a cold plate thermally coupled to the heat-generating component device to transfer heat from the heat-generating component device into a cold side tank thermally coupled between the cold tank and a hot side tank, a TEC chip to, when a voltage is applied to the TEC chip increase a rate of thermal transfer of heat from the cold side tank of a first liquid cooling loop to the hot side tank of a second liquid cooling loop, and a radiator thermally coupled to the hot side tank in the second liquid cooling loop to dissipate heat transferred to the radiator out of the information handling system.

System and method for all-in-one compact refrigeration using a liquid cooling solution for a hardware processor

An information handling system having a reconfigurable cooling fan holder including a plurality of cooling fans of a cooling system operatively coupled to the reconfigurable cooling fan holder, a reconfigurable frame having a plurality of slidingly adjustable walls including a pair of lengthwise slidingly adjustable walls and a widthwise slidingly adjustable wall where the pair of lengthwise slidingly adjustable walls may be expanded or reduced in length by sliding the at least two slide bars nested adjacent to one another forming each lengthwise slidingly adjustable wall to extend or contract each lengthwise slidingly adjustable wall, and the widthwise slidingly adjustable wall may be expanded or reduced in width by sliding the at least two slide bars nested adjacent to one another forming the widthwise slidingly adjustable wall to extend or contract the widthwise slidingly adjustable wall for adjusting the width and length of the reconfigurable cooling fan holder.

System and method for a universal fan holder for a cooling fan for information handling systems

Tool-less apparatus and methods are provided for sealing flow of cooling air from the outlet of a cooling fan blower to the inlet of a heat exchanger within a chassis enclosure of an information handling system. The disclosed apparatus and methods may be implemented in a tool-less manner by employing tool-less chassis mounting features that mate with tool-less cooling fan mounting features to mechanically align and secure an air outlet of a cooling fan blower in sealing relationship with an air inlet of a heat exchanger within a chassis enclosure of an information handling system by properly aligning the axes of a cooling fan in relation to the inlet of the heat exchanger so that in on embodiment no gap exists between the cooling air outlet of the cooling fan and the cooing air inlet of the heat exchanger.

Tool-less apparatus and methods for sealing the flow of cooling fan air to a heat exchanger

A chemical mechanical polishing (CMP) apparatus includes a processing chamber, a platen, a wafer heater and a carrier head. The platen is disposed in the processing chamber and is configured to allow a polishing pad to be disposed thereon. The wafer heater is disposed in the processing chamber and is configured to heat a wafer. The carrier head is disposed in the processing chamber and is configured to hold the heated wafer against the polishing pad.

Growing community of inventors

Taipei, Taiwan

Yu-Ming Kuo