Global Unichip Corporation

Taiwan Semiconductor Manufacturing Comp. Ltd.

Yu-Min Sun

Chih-Feng Cheng

Chih-Chieh Liao

Pei-Shiou Huang

An electric device includes a semiconductor assembly, a circuit board, first conductive pads and second conductive pads. The circuit board has a chip-mounted area with a rectangular shape. The first conductive pads are arranged in a center zone or all corner zones of the chip-mounted area, and the second conductive pads are arranged within the rest in the chip-mounted area. The first conductive pads are respectively soldered to one part of solder joints of the semiconductor assembly through first solder-ball portions, and the second conductive pads are respectively soldered to another part of the solder joints of the semiconductor assembly through second solder-ball portions. Each of the second conductive pads is sized smaller than one of the first conductive pads, and a maximum width of each of the second solder-ball portions is greater than a maximum width of each of the first solder-ball portions.

Electric device, its circuit board and method of manufacturing the electric device

A probe card device includes a wiring board provided with a plurality of contacts, a probe head having a probe holder and a plurality of conductive probes arranged on the probe holder, respectively, and a circuit protection assembly including an insulation plate, a plurality of through holes and a plurality of self-resetting fusing elements. The insulation plate is sandwiched between the wiring board and the probe head. The through holes are respectively formed on the insulation plate and arranged in an array form. The self-resetting fusing elements are respectively disposed within the through holes. Each of the self-resetting fusing elements is electrically connected to one of the contacts and one of the conductive probes for reversibly breaking down electric currents from the wiring board to the conductive probe.

Probe card device and circuit protection assembly thereof

A testing apparatus includes a circuit board, a probe station and a probe array. The circuit board includes a plurality of contacts. The probe station includes a platform located on the circuit board and used for carrying a device under test (DUT), and a plurality of probe holes formed on the platform and arranged in an array. The probe array includes a plurality of telescopic probes respectively linearly inserted into the probe holes. One end of each of the telescopic probes is contacted with one of the contacts, and the other end thereof is contacted with one of solder balls of the DUT. Each of the probe holes includes an elongated groove penetrating through the platform. Each of the telescopic probes is provided with a fin protruding outwardly and inserting into the elongated groove.

Testing apparatus

An inspecting device including a carrier, multiple telescopic probes, a locking component and a conductive structure is provided. The carrier has a through hole and a ground pad corresponding to the through hole. The through hole penetrates from the first surface to the second surface of the carrier, and the ground pad is disposed on the second surface. The telescopic probes are disposed in parallel on the first surface of the carrier. The locking component passes through the through hole and is disposed between two adjacent telescopic probes of the multiple telescopic probes. The locking component includes a screw. A head of the screw has a first pitch and a second pitch, and a density of the first pitch is different from a density of the second pitch. The conductive structure is partially embedded in the locking component, and the conductive structure, the locking component and the ground pad are electrically connected.

Inspecting device

A thermal peak suppression device includes a heat dissipation fin set, a heat dissipator, a thermal phase change material, a filling gas, a fin-array frame and a capillary tube. The heat dissipator includes a thermal conductive block thermally coupled to the heat dissipation fin set, and a closed cavity formed inside the thermal conductive block to have a hot zone and a cold zone. The thermal phase change material is disposed within the hot zone. The filling gas is disposed within the cold zone. The fin-array frame is connected to the thermal conductive block within the cold zone. Two opposite ends of the capillary tube are respectively located within the cold zone and the hot zone. When the thermal phase change material is transformed into a liquid state, the thermal phase change material is sent to the hot zone through the capillary tube.

Thermal peak suppression device

A pogo pin-free testing device for IC chip test includes a load board, a ceramic interposer disposed on the load board, and copper core balls. The ceramic interposer has first and second surfaces and connecting points, and the second surface of the ceramic interposer faces the load board. Each connecting point has through holes penetrating the first and second surfaces, and an inner sidewall surface thereof has a metallization layer. The metallization layer is extended to a portion of the first surface and a portion of the second surface. In each of the connecting points, an area of an extending portion of the metallization layer extended to the second surface is less than an area of an extending portion of the metallization layer extended to the first surface. The copper core balls are disposed between the load board and the through holes of each connecting point of the ceramic interposer.

Pogo pin-free testing device for IC chip test and testing method of IC chip

A testing apparatus including a base and a preheating unit arranged on the base is provided. The preheating unit includes a gas generator, a blocking mechanism and a heating device. The gas generator is configured to discharge air toward the base to form an air wall. The blocking mechanism is located above the air wall and forms a heat preservation space with the air wall. The heating device is arranged in the heat preservation space.

A testing system includes a testing apparatus and a crack noise monitoring device. The testing apparatus includes a testing stage and an element pickup module for pressing a semiconductor element on the testing stage. The crack noise monitoring device includes a database unit, a sound conduction set, a voiceprint generation unit and a processing unit. The database unit has a first voiceprint pattern. The sound conduction set is connected to the voiceprint generation unit and the testing apparatus for transmitting a sound wave from the semiconductor element to the voiceprint generation unit. The voiceprint generation unit receives and converts the sound wave into a second voiceprint pattern. The processing unit is electrically connected to the voiceprint generating unit and the database unit for determining whether the first voiceprint pattern is identical to the second voiceprint pattern.

Testing system, crack noise monitoring device and method for monitoring crack noise

A testing socket includes a metal block, an assembly block, an analog ground probe pin and a digital ground probe pin. The metal block is formed with a concave portion and used to connect to an independent main ground. The assembly block is electrically isolated from the metal block, and detachably embedded in the recess, so that the metal block and the assembly block are assembled together to be a probe holder. The digital grounding probe is inserted in the metal block, electrically connected to the independent main ground through the metal block. The digital ground probe pin can be electrically connected to a device to be tested (DUT) and the independent main ground. The analog ground probe pin is inserted in the assembly block, and electrically connected to the DUT and another independent main ground.

Inspecting device and its testing socket

A testing equipment includes a testing platform and a component carrying device including a carrying arm, a vacuum suction unit, a working bottom cover and a fluid transmission assembly. The carrying arm lifts and carries a device under test (DUT) onto the testing platform. The vacuum suction unit removably sucks to the DUT. The working bottom cover includes a cover body and an elastic airtight ring. The cover body is connected to the carrying arm, and the elastic airtight ring is fixedly disposed on the cover body for hermetically covering the DUT, so that a liquid filling space is collectively formed by the cover body and the DUT. The fluid transmission assembly extends into the liquid filling space for continuously passing a working liquid to the DUT and withdrawing the working liquid back away from the liquid filling space for thermally exchanging with the DUT.

Testing equipment, its component carrying device and testing method of the testing equipment

A probe card module including a probe card assembly and a strengthening structure is provided. The probe card assembly includes a first surface, a second surface opposite to the first surface, and a plurality of probes protruding from the first surface. The second surface includes a central zone and a peripheral zone surrounding the central zone. Projections of the probes on the second surface are located at the central zone. The strengthening structure is disposed on the second surface and includes two support bases which protrude from the peripheral zone and are away from each other, and the strengthening structure also includes an arc-shaped reinforcement assembly connected to the two support bases, where the arc-shaped reinforcement assembly protrudes toward and leans against the central zone.

Probe card module

A testing system for semiconductor package components includes a testing circuit board, a test socket, at least one probe pin and a thermal barrier layer element. The testing circuit board has at least one electrical contact. The test socket is used to receive a DUT. The probe pin is located on the test socket for contacting with the DUT. The thermal barrier layer element is located between the testing circuit board and the test socket, electrically connected to the probe pin and the electrical contact, and thermally isolated the electrical contact from the probe pin.

Testing system for semiconductor package components and its thermal barrier layer element

A drying apparatus includes an oven body, a magnetic field generating device, a chamber pressure controlling device and a baking device. The oven body is provided with a chamber which is air-hermetic for receiving a semiconductor package element. The chamber pressure controlling device reduces a chamber pressure of the chamber. The magnetic field generating device polarizes liquid on the semiconductor package element in the chamber. The baking device evaporates the liquid on the semiconductor package in the chamber.

Drying apparatus

A carrying device includes a main body, a grasping portion, a heat-exchanging module and a gas chamber device. The grasping portion is connected to the main body for grasping a semiconductor element. The heat-exchanging module is disposed on the main body. The gas chamber device includes a case body and a gas. The case body is disposed between the grasping portion and the heat-exchanging module, and has a closed chamber therein. The gas fills the closed chamber for transferring heat from the semiconductor element to the heat exchanging module, in which a specific heat capacity of the gas is about between 5000 J/(kg&#xb7;K)-15000 J/(kg&#xb7;K).

Testing equipment for semiconductor element and its carrying device

A probe loader device includes a carrier board, a three-dimensional stepped structure and a probe module having a plurality of probe pin layers separately stacked together in three-dimensional stepped structure. The three-dimensional stepped structure is connected to the carrier board. Each of the probe pin layers includes a plurality of cantilever probes. The cantilever probes respectively extend outwards from different steps of the three-dimensional stepped structure, and physical touch a plurality of electrical contacts of a DUT. A portion of each of the cantilever probes extending outwards from the three-dimensional stepped structure has a moment length, and the moment lengths of the cantilever probes of the different probe pin layers are the same.

Growing community of inventors

Hsinchu, Taiwan

Yu-Min Sun