Seoul National University

Korea Inspection Eng. Co., Ltd

Yu Min Choi

Ik Keun Park

Bum Joon Kim

Hye Jin Park

Hong Seok Kim

Tae Sung Park

Seong Jin Lim

In Gon Jung

Dong Ryul Kwak

The present invention relates to a scanner having a flexible probe which is an apparatus capable of being utilized for an inspection on a weld zone of a general ferrite material and a stainless material and allowing an inspection to be performed on a fitting weld zone where it is difficult for a general phased array ultrasonic testing (PAUT) probe to approach. A scanner having a flexible probe according to the present invention includes a probe fixing body () which moves while coming into contact with a surface of a bent fitting pipe and to which a probe body () is fixed, a flexible connecting chain part () installed to be connected to one end of the probe fixing body () and having a freely bendable structure, a sensor installation part () installed on an end of the flexible connecting chain part () and configured to move while pressed against the surface of the fitting pipe, a sensor () which is connected to the probe body () in a flexible state and of which an end is installed on the sensor installation part () and scans a weld zone of the fitting pipe, and an encoder part () installed to be connected at one side of the probe fixing body () and configured to move while pressed against the fitting pipe and detect a moving distance and a position.

Scanner having flexible probe

A hepatitis B virus-derived polypeptide exhibits anti-viral effects not only on HIV-1 and HBV but also on all viruses by increasing the expression of type I interferon. The hepatitis B virus-derived polypeptide has a synergistic effect when co-administered with a conventional anti-viral agent. The hepatitis B virus-derived polypeptide is effectively usable in the treatment of virus-related diseases such as AIDS or liver diseases.

Hepatitis B virus-derived polypeptide and anti-viral use thereof

Disclosed are a method for measuring the adhesive strength of a thin film using surface waves, and a computer-readable recording medium having a program for performing same recorded thereon. The method for measuring the adhesive strength of a thin film measures the adhesive strength between a substrate and a thin film by means of an electronic calculator, using sound waves measured from a thin film structure having a thin film formed on a substrate. The method, which is performed by the electronic calculator, comprises the steps of: receiving, as a first input value, the thickness, density, longitudinal wave velocity, and shear wave velocity of a first thin film and a substrate the adhesive strength between which is to be measured; calculating, from the first input value, the thickness and density of a second thin film virtually configured between the first thin film and substrate, and setting as a second input value; calculating the longitudinal wave velocity and shear wave velocity of the second thin film according to the stiffness constant of the second thin film, while varying the stiffness constant, and setting as a third input value; using the first to third input values to acquire a transfer matrix between the first thin film, second thin film, and substrate; using the transfer matrix to calculate the dispersion characteristics of the speed of surface waves; and substituting, to dispersion curves, the propagation speed of the surface waves measured from the substrate having the first thin film formed thereon, in order to acquire the stiffness constant matching the propagation speed of the measured surface waves and measure the adhesive strength between the substrate and the thin film.

Method for measuring adhesive strength of thin film using dispersion characteristics of surface waves, and computer-readable recording medium having program for performing same recorded thereon

Growing community of inventors

Seoul, South Korea

Yu Min Choi