Asm Technology Singapore Pte Ltd

Yu Lung Lam

Yiu Fai Kwan

Tat Chi Chan

Ching Man Tsui

Gio Jose Asumo Villaespin

Ho Ki Yeung

Hang Ren

A routable electroforming substrate for assembling a semiconductor package is manufactured by providing a carrier and plating a patterned first metallic layer onto the carrier which is configured to function as a surface mount pad or input/output pad in an assembled semiconductor package. A patterned second metallic layer comprising copper is plated over the first metallic layer, and a third metallic layer, which is configured for mounting a plurality of semiconductor dice, is plated over the second metallic layer. The carrier is then removed to expose the first metallic layer.

Routable electroforming substrate comprising removable carrier

A lead frame comprises a substrate comprising copper and includes a layer of bright silver is plated onto the substrate. A layer of doped bright silver is thereafter plated over a top surface of the layer of bright silver for enhancing the performance of LED devices utilizing the lead frame.

Plated lead frame including doped silver layer

Growing community of inventors

Hong Kong, China

Yu Lung Lam