Taiwan Semiconductor Manufacturing Comp. Ltd.

Hewlett-packard Development Company, L.p.

The Johns Hopkins University

Inventec Corp.

National Yang Ming Chiao Tung University

Academia Sinica

Inventec (pudong) Technology Corporation

Yu-Ling Lin

Hsiao-Tsung Yen

Chin-Wei Kuo

Min-Chie Jeng

Ho-Hsiang Chen

Chewn-Pu Jou

Huan-Neng Chen

Ying-Ta Lu

Jhe-Ching Lu

Mei-Show Chen

Cheng-Hsien Hung

Tzuan-Horng Liu

Hsien-Pin Hu

Feng-Wei Kuo

Hui Yu Lee

Yen-Jen Chen

Chung-Yu Lu

Sa-Lly Liu

Victor Chih Yuan Chang

Cheng Hung Lee

Fu-Lung Hsueh

Feng Wei Kuo

Kuan-Ting Wu

Cheng-Wei Luo

Chi Hao Chang

Cheng-Hung Lee

Ru Chih C Huang

Kuang-Wen Liao

Yu-Chuan Liang

David Mold

Fa-Chih Ke

Wen-Hsiang Chen

Jong Ho Chun

Ting-Yu Wang

Tiffany Jackson

Chien-Hsien Lai

Wen-Ching Lin

Kunag-Wen Liao

The present invention provides novel pharmaceutical formulations comprising derivatives of NDGA, including MN (tetra-0-methyl nordihydroguaiaretic acid) and temozolomide and their use in the inhibition and treatment of neoplastic diseases, including glioblastoma multiforme, lung and other cancers.

Formulations of terameprocol and temozolomide and their use in stimulation of humoral immunity in tumors

Methods and apparatus for forming a semiconductor device package with a transmission line using a micro-bump layer are disclosed. The micro-bump layer may comprise micro-bumps and micro-bump lines, formed between a top device and a bottom device. A signal transmission line may be formed using a micro-bump line above a bottom device. A ground plane may be formed using a redistribution layer (RDL) within the bottom device, or using additional micro-bump lines. The RDL formed ground plane may comprise open slots. There may be RDLs at the bottom device and the top device above and below the micro-bump lines to form parts of the ground planes.

Method of forming semiconductor package transmission lines with micro-bump lines

A multi-shot moulding part structure includes a first structural part, an ink decoration layer, and a second structural part. The first structural part has a first area surface, a second area surface, and a joining surface located on the second area surface. The joining surface is non-parallel to the second area surface. The ink decoration layer is spread on the first area surface and the second area surface, but not on the joining surface. The second structural part is combined with the first structural part and covers the second area surface. The second structural part touches the joining surface. By the second structural part touching the joining surface of the first structural part that is not coated with the ink decoration layer, the structural bonding strength between the first structural part and the second structural part is enhanced.

Multi-shot moulding part structure

An integrated circuit package includes a die. An electrically conductive layer comprises a redistribution layer (RDL) in the die, or a micro-bump layer above the die, or both. The micro bump layer comprises at least one micro-bump line. A filter comprises the electrically conductive layer. A capacitor comprises an electrode formed in the electrically conductive layer.

Filter and capacitor using redistribution layer and micro bump layer

A semiconductor structure is provided. The semiconductor structure includes a floating substrate; and a capacitor grounded and connected to the floating substrate. A method of manufacturing a semiconductor structure is also provided.

Semiconductor structure

A device includes a substrate, and a vertical inductor over the substrate. The vertical inductor includes a plurality of parts formed of metal, wherein each of the parts extends in one of a plurality of planes perpendicular to a major surface of the substrate. Metal lines interconnect neighboring ones of the plurality of parts of the vertical inductor.

Compact vertical inductors extending in vertical planes

The present subject matter relates to fabrication of micro-arc oxidation (MAO) based insert-molded components. In an example implementation, a method of fabricating a MAO based insert-molded component comprises forming an insert-molded component and oxidizing the insert-molded component through MAO. The insert-molded component has a metal body molded with a plastic body. On oxidation of the insert-molded component through MAO an oxide layer is formed on the metal body.

Insert-molded components

Methods and apparatus for transmission lines in packages

Interposer and semiconductor package embodiments provide for the isolation and suppression of electronic noise such as EM emissions in the semiconductor package. The interposer includes shield structures in various embodiments, the shield structures blocking the electrical noise from the noise source, from other electrical signals or devices. The shields include solid structures and some embodiments and decoupling capacitors in other embodiments. The coupling structures includes multiple rows of solder balls included in strips that couple the components and surround and contain the source of electrical noise.

Interposer and semiconductor package with noise suppression features

Growing community of inventors

Taipei, Taiwan

Yu-Ling Lin