Taiwan Semiconductor Manufacturing Comp. Ltd.

Yu-Lin Wang

Wei-Chih Chen

Ming-Tan Lee

Wen-Ming Chen

Yuh-Sen Chang

Chih-Yuan Chiu

Yi-Ting Hu

Pei-Shan Wu

Pin-Yi Shin

A bonding apparatus includes a wafer stage, a first chip stage, a first chip transporting device, a second stage and a second chip transporting device. The wafer stage is used for holding a wafer. The first chip stage is used for holding at least one first chip. The first chip transporting device is used for transporting the first chip from the first chip stage onto the wafer. The second chip stage is used for holding at least one second chip. The second chip transporting device is used for transporting the second chip from the second chip stage onto the wafer.

Bonding apparatus and method

Growing community of inventors

Hsinchu County, Taiwan

Yu-Lin Wang