Industrial Technology Research Institute

Atma Champ Ent. Corp.

Yu-Lin Hsu

Chao-Feng Sung

Kuo-Hsin Huang

Hsin-Yun Hsu

Hung-Hsien Ko

Yu-Ming Peng

Chien-Hung Lin

Ting-Yu Ke

Kuan-Chu Wu

Chih-Ming Lai

Chih-Chia Chang

Kuo-Hua Tseng

Kai Hsiang Chang

I-Hung Chiang

Cheng-Ta Pan

Min-Hsiung Liang

Ting-Yu Wang

Pang-Min Shih

Hung-Yi Chang

Chien-Chou Tseng

I-Chung Kao

Kuo-Jung Sun

Shou-Cheng Shen

An electronic apparatus including a compression molding board and a connection pad is provided. The compression molding board has a device bonding area and a bending area formed by compression molding. The device bonding area is different from the bending area. The connection pad is disposed on the device bonding area of the compression molding board.

Electronic apparatus

An electronic device includes a substrate, an electronic component, a first interposing layer and a second interposing layer. The substrate is non-planar and the substrate includes a first substrate pad and a second substrate pad. The electronic component includes a first component pad and a second component pad corresponding to the first substrate pad and the second substrate pad respectively. When the first component pad contacts the first substrate pad, a height difference exists between the second component pad and the second substrate pad. The first interposing layer connects between the first component pad and the first substrate pad. The second interposing layer connects between the second component pad and the second substrate pad. A thickness difference between the first interposing layer and the second interposing layer is 0.5 to 1 time the height difference.

Electronic device and method of manufacturing electronic device

A stretchable circuit is provided in the invention. The stretchable circuit comprises a plurality of segments. Each segment includes a plurality of sub-segments. Each sub-segment includes at least one main line, at least one secondary line, and rib lines, and in each sub-segment, the main lines and the secondary lines are electrically connected to the rib lines.

Stretchable circuit and layout method for stretchable circuit

A strain measurement method includes disposing a 3D camera module at a first measurement position; using the 3D camera module to acquire a first 3D image of a to-be-measured object at a first to-be-measured position; acquiring a second 3D image of the to-be-measured object at the first to-be-measured position; and splicing the first and second 3D images to obtain an initial 3D image. The method still includes: moving the 3D camera module from the first measurement position to a second measurement position; using the 3D camera module to acquire a third 3D image of the to-be-measured object at a second to-be-measured position; acquiring a fourth 3D image of the to-be-measured object at the second to-be-measured position; and splicing the third and fourth 3D images to obtain a deformed 3D image. The method further includes comparing the initial 3D image and the deformed 3D image to output 3D deformation information.

Strain measurement method and strain measurement apparatus

An evaporation apparatus including a material source, a chamber, a passageway, and a heating component is provided. The material source is configured to provide a deposition material. The chamber includes a manifold. The passageway is configured to be connected to the material source and the manifold. The heating component is disposed in at least a portion of the passageway and configured to heat the deposition material. A calibration method of the evaporation apparatus is also provided.

Evaporation apparatus and calibration method thereof

A roller assembly for transporting a substrate includes a step roller and a plurality of first auxiliary rollers. The step roller includes a main roller, and a pair of edge rollers sleeved on the main roller and located on two opposite ends of the main roller, respectively. The plurality of first auxiliary rollers are disposed on two opposite sides of the step roller, respectively. A first film forms a closed loop through the first film being rolled on the plurality of first auxiliary rollers and the step roller cyclically. A method using the same is also provided.

Roller assembly and method for transporting a substrate using the same

A film thickness monitoring system is provided. The film thickness monitoring system includes a source, a valve, and a chamber. The source is configured to provide a deposition material. The valve is connected to the source. The chamber includes a manifold, a quartz crystal microbalance, and a pressure sensor. The manifold is connected to the valve and has at least one first nozzle and at least one second nozzle. The quartz crystal microbalance is disposed opposite to the at least one second nozzle. The deposition material is adapted to be deposited on the quartz crystal microbalance through the at least one second nozzle, and the quartz crystal microbalance includes a shutter facing the at least one second nozzle. The pressure sensor is disposed in the manifold. A method for monitoring a film thickness deposition process is also provided.

Film thickness monitoring system and method using the same

A roller assembly for transporting a substrate includes a step roller, a first transport roller, and a second transport roller. The step roller includes a main roller, an air cylinder, and a pair of edge rollers. The air cylinder is sleeved on the main roller, and includes a plurality of air jetting holes and a plurality of air suction holes. The edge rollers are disposed on the main roller and are located on opposite ends of the air cylinder. The first transport roller and the second transport roller are disposed on opposite sides of the step roller, wherein the substrate is transported from the first transport roller to the second transport roller through the step roller. A method using the same is also provided.

Roller assembly, step roller thereof, and method for transporting substrate using the same

Growing community of inventors

Tainan, Taiwan

Yu-Lin Hsu