Gemtek Technology Co., Ltd.

Mediatek Corporation

Yu-Lin Hsieh

Shih-Chieh Yen

Ming-Yu Hsieh

Sheng-Che Tseng

Kuo-Tsai Lee

Jen-Kuei Tsai

Jie-Yuan Wu

A wireless communication device includes a first wireless communication system and a second wireless communication system. Regarding the first wireless communication system, an up-conversion circuit up-converts a first transmit (TX) signal in a baseband to generate a second TX signal with a first carrier frequency, and a front-end circuit transmits the second TX signal to another wireless communication device. Regarding the second wireless communication system, a first down-conversion circuit down-converts a first receive (RX) signal with a second carrier frequency to generate a second RX signal with a third carrier frequency, and a second down-conversion circuit down-converts the second RX signal with the third carrier frequency to generate a third RX signal in the baseband. The third carrier frequency is different from all fundamental frequencies included in a band combination that is employed at the first wireless communication system and is supported by another wireless communication device.

Wireless communication device with frequency planning for spur avoidance under coexistence of multiple wireless communication systems

A wireless communication device includes a wireless transceiver, an analog-to-digital converter (ADC), and a processor. The ADC is configured to read a sensing value to generate a piece of sensing data. The processor is electrically connected to the wireless transceiver and the ADC. When an interrupt request is detected, the processor sends the piece of sensing data via the wireless transceiver.

Wireless communication device

The present invention discloses a structure of a single-sided PCB within an ExpressCard with SMD LEDs arrangement formed thereon. The SMD LEDs are act as status indicators for the electronic devices with small, thin and compact size. The structure is expected to form SMD LED illuminating light to the top surface of the PCB with SMD LEDs connecting to the bonding pads on the bottom surface of the PCB. The method comprises forming through-holes on the PCB, placing SMD LEDs over the through-holes with their illuminating heads facing toward the top surface of the PCB, soldering the SMD LEDs with the bonding pads on the bottom surface of the PCB.

Optimum structure for single-sides PCB with SMD LEDs for the express card

Growing community of inventors

Hsinchu, Taiwan

Yu-Lin Hsieh