Taiwan Semiconductor Manufacturing Comp. Ltd.

Yu-Liang Tseng

Chung-Pin Chou

A particle removal tool includes a workpiece holder and an optical tweezer. The workpiece holder is configured to support a workpiece. The optical tweezer is configured to emit a plurality of focused light beams to the workpiece, wherein the plurality of focused light beams are respectively converged to focal points between the optical tweezer and the workpiece, and are configured to take particles away from the workpiece.

Tool and method for particle removal

A method includes generating a primary radiation beam from a radiation source; splitting the primary beam into a first radiation beam and a second radiation beam; directing the first radiation beam onto a front side of a wafer; directing the second radiation beam onto a back side of a wafer; generating an image of the front side of the wafer by receiving a reflection of the first radiation beam reflected from the wafer; and generating an image of the back side of the wafer by receiving a reflection of the second radiation beam reflected from the wafer.

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Hsinchu, Taiwan

Yu-Liang Tseng