Industrial Technology Research Institute

Yu-Kon Chou

Tsung-Ter Kuo

Mao-Shun Su

Kuo-Hua Tseng

Ming-Kaan Liang

Lung-Tai Chen

Yii-Tay Chiou

Wen-Yang Chou

Pei-Ying Shieh

Ping-Huang Chiang

Chun-Kai Liu

Shih-Chi Kuo

Shin-Terng Chiang

Chien-Chi Chao

Pin-Hsun Huang

This invention provides a flexible antenna module for wireless energy transmission, which uses an antenna size controlling device to adjust the antenna's size to conform a living body's outer portion wearing the flexible annular antenna. An antenna energy transmission control module is provided to adjust the power for driving the flexible annular antenna according to the deformation of the flexible annular antenna. This invention can adjust both the antenna size to fit the individual and the power for driving the antenna. The individual can use the present antenna module under a comfortable, safe and reliable circumstance.

Flexible antenna module for wireless energy transmission

The present invention relates to a stethoscope auscultation method, adapted for an improved stethoscope so as to be used for assisting a medical diagnosis according to visceral sounds. The stethoscope auscultation method comprises the steps of: providing a stethoscope, whereas the stethoscope is composed of a stethoscope head module, a processing unit and a signal output unit, and the stethoscope head module further comprises a sensor and a visceral sound receiver; enabling the sensor to issue an activation signal to the processing unit as soon as it detects that the stethoscope head module enters an auscultation mode, and thereby activating the stethoscope; using the stethoscope to perform an auscultation process upon a living body as the visceral sound receiver is enabled to obtain audio signals originated from the visceral organs of the living body; enabling the processing unit to shut off the stethoscope automatically when the visceral sound receiver is unable to obtain the audio signals originated from the visceral organs for environmental purposes, such as reducing power consumption of the stethoscope, prolonging lifespan of the battery used in the stethoscope.

Electronic stethoscope and the stethoscope auscultation method using the same

A stethoscope capable of eliminating unwanted sounds and method thereof, the stethoscope and method thereof mainly use a stethoscope head containing a sensor and a signal processing circuit. By way of detecting and judging whether the stethoscope head arrives on correct stethoscopic position by the sensor, unwanted sounds generating by frictions, translations, or collisions during the stethoscopic process can be effectively eliminated such that the stethoscopic quality can be improved. Thus, a doctor can use less time and spirit to make a correct diagnosis for a patient with least unwanted interference sounds.

Stethoscope capable of eliminating unwanted sounds and method thereof

A method and device for automatically detecting heart valve damage for four heart valves are proposed. The automatic determination method makes use of three or more heart tone microphones to simultaneously record heart tones of a patient's heart, and then separates the heart tones into four heart tone signals of the aortic valve, the pulmonary valve, the tricuspid valve and the mitral valve of the heart based on the timing characteristics and related techniques. Next, these four heart tone signals are digitally processed into sampling signals. Subsequently, the convolution method is used to process the sampling signals for producing system transfer functions. Finally, the system transfer functions and the reference database are compared to verify and determine damage for the four heart valves. The automatic determination method can judge heart valve damage to enhance the quality and convenience of medical treatment.

Method and device for automatically determining heart valve damage

A microneedle array device and its fabrication method are provided. The microneedle array device comprises a supporting pad and a plurality of microneedles. Each microneedle has a top portion with a via thereon, thereby the microfluid may flow in or out. The intersection between the top portion and the inner tube of a microneedle forms a convex needle structure, and is almost perpendicular to the upper surface. For each microneedle, a hollow closed tube is formed between the top portion and the supporting pad. The fabrication method uses substrates with high transmittance and a plurality of convex area thereon as upper and lower caps, and applies a photolithography process to fabricate a microneedle array mold. It then sputters or electroplates metal material on the mold. The microneedle array is formed after having taken off the mold.

Microneedle array device and its fabrication method

A dynamic pressure sensing structure used in a condenser microphone includes an upper electrode plate, a lower electrode plate, a spacer and a substrate, wherein the upper and lower electrode plates are separated by the spacer and form a resonance cavity with the substrate. The upper electrode plate comprises a flat vibration area and a surrounding flexible area connected thereto. The lower electrode plate comprises a sensible electrode and an actuation electrode surrounding the sensible electrode. The plate is in connection with the flexible area so that a capacitor is formed between the sense area and the flat vibration area. The actuation electrode provides a polarization voltage to generate an electrostatic force, thereby attract the flexible vibration area to curve downwards so that the flat vibration area moves in a flat state and a distance between the flat vibration area and the sensible electrode is varied correspondingly.

Dynamic pressure sensing structure

A passive alignment packaging structure for opto-electrical devices and optic fiber connectors provides a passive alignment packaging structure for opto-electrical devices and optic fiber connectors. The passive alignment packaging is of great benefit to automatic assembly in lowering the manufacturing cost and satisfying the requirement of a precisely aligned optical path. The invention connects the silicon substrate for installing an opto-electrical device to a leadframe by soldering. The surface tension of the melted soldering tin helps self-alignment in the horizontal direction. A guiding pin penetrates through the leadframe and the through hole of a lens support for installing a micro lens set to have vertical alignment. The opto-electrical device, the micro lens set, and the optic fiber connector are thus precisely aligned. The leadframe and the through hole on the lens support have alignment and stress relaxation designs to reduce deformation. It can prevent stress from accumulating on the guiding pin and the opto-electrical device due to thermal expansion. The invention can therefore increase the yield and reliability.

Passive alignment packaging structure for opto-electrical devices and optic fiber connectors

The present invention includes a substrate having a first opening. A heat spreader is attached on the bottom surface of the substrate. The bottom side surface of the heat spreader has trench pattern. The trench pattern includes a plurality of connecting cavities and a plurality of trenches. The chip is mounted on the top side surface of the heat spreader. A supporting member is formed on the top side surface of the substrate. The space among the substrate, the chip, the heat spreader and the supporting member is encapsulated by encapsulating material. The preformed solder balls are mounted on the bottom side surface of the substrate.

Structure for semiconductor package for improving the efficiency of

An integrated circuit (IC) package includes solder paste inter-layer and alignment apparatus 100 for applying and aligning solder paste 150 with corresponding solder pads 160 on the IC package carrier 200. The apparatus 100 includes a thin layer 100 which is composed of high-temperature-resistant, non-solder-wetting, and electrical-insulating materials. The apparatus further has a plurality of apertures 110, each disposed on and penetrating through the thin layer 100 for applying solder paste 150 therein and for aligning with the corresponding solder pads 160 on the IC package carrier 200. The apparatus 100 further includes a removable thin film tape 120 disposed on a bottom surface of the thin layer 100 for temporarily maintaining the solder paste 150 in the plurality of apertures 110.

Growing community of inventors

Hsinchu, Taiwan

Yu-Kon Chou