Taiwan Semiconductor Manufacturing Comp. Ltd.

Realtek Semiconductor Inc.

Advanced Semiconductor Engineering, Inc.

Yu Kai Chen

Li-Jen Wu

Ko-Bin Kao

Shi-Ming Wang

Chin-Kun Fang

Oliver Yu

Yong-Ting Wu

Su-Yu Yeh

Piao-Chuo Tsao

Szu-Ping Chen

Huei-Chi Chiu

Sharon Yang

Shin-Meei Wang

Y L Huang

Chung-Yao Chang

Min Lung Huang

Huang-Hsien Chang

Syu-Tang Liu

Chia-Hung Chung

Shao Hsuan Chuang

Tsung-Hsuan Lee

Wen-Shiung Chen

Kai-chih Liang

Forster Yuan

An edge exposure tool may include a lens adjustment device that is capable of automatically adjusting various parameters of an edge exposure lens to account for changes in operating parameters of the edge exposure tool. In some implementations, the edge exposure tool may also include a controller that is capable of determining edge adjustment parameters for the edge exposure lens and exposure control parameters for the edge exposure tool using techniques such as big data mining, machine learning, and neural network processing. The lens adjustment device and the controller are capable of reducing and/or preventing the performance of the edge exposure tool from drifting out of tolerance, which may maintain the operation performance of the edge exposure tool and reduce the likelihood of wafer scratching, and may reduce the down-time of the edge exposure tool that would otherwise be caused by cleaning and calibration of the edge exposure lens.

Lens adjustment for an edge exposure tool

A semiconductor device manufacturing system and a method for manufacturing semiconductor device are provided. The semiconductor device manufacturing system includes a conditioner connected to a semiconductor device manufacturing apparatus, a data collector connected to the conditioner and a processor connected to the data collector. The conditioner is configured to control a temperature and a humidity of an air and deliver the air to the semiconductor device manufacturing apparatus. The data collector is configured to collect data from the conditioner. The processor is configured to receive the data transferred from the data collector.

Semiconductor device manufacturing system and method for manufacturing semiconductor device

A system for detecting leakage of a liquid supply pipe includes a pipe casing for enclosing an end portion of the liquid supply pipe adjoined to a nozzle and a sensor system configured to detect presence of a liquid leaked from the liquid supply pipe at the end portion. The sensor system is in alignment with the end portion of the liquid supply pipe.

System and method for liquid leak detection

A method for eliminating bubbles from a liquid dispensing system includes flowing a liquid containing bubbles into a liquid inlet of a tank from a filter to substantially fill the tank, wherein substantially all bubbles accumulate in an upper portion of the tank having a lateral dimension greater than a lateral dimension of a lower portion of the tank, and flowing the liquid into the tank comprises flowing the liquid through an inlet pipe extending at an acute angle relative to a horizontally-oriented axis of the tank. The method further includes flowing a liquid substantially free of bubbles out of the tank via a liquid outlet at the lower portion of the tank for dispensing to a substrate.

Method of using liquid supply system with improved bubble venting capacity

The present disclosure describes a method for replacing a photoresist (PR) bottle using a vehicle. An exemplary vehicle includes a processor configured to receive a request signal to replace a first PR bottle. The processor is also configured to transmit an order based on the request signal. The vehicle also includes a plurality of wheels configured to move the vehicle from the first location to a second location, and from the second location to the first location. The vehicle further includes a robotic arm configured to load, at the first location, the first PR bottle into a first container; load a second PR bottle in a second container; remove a cap from the second PR bottle and a socket from the first PR bottle; couple the socket of the first PR bottle to the second PR bottle; and unload the second PR bottle from the second container.

Photoresist bottle replacement system

A system for dispensing a liquid includes a filter adapted to filter a liquid and to provide a filtered liquid at a liquid outlet of the filter, and a tank having a liquid inlet coupled to the liquid outlet of the filter via a first pipe. The tank includes an upper portion having a first lateral dimension and a lower portion having a second lateral dimension less than the first lateral dimension. The upper portion of the tank is above the liquid inlet of the tank.

Liquid supply system with improved bubble venting capacity

The subject application relates to a semiconductor package device, which includes a first conductive layer; a semiconductor wall disposed on the first conductive layer; a first conductive wall disposed on the first conductive layer; and an insulation layer disposed on the first conductive layer and between the semiconductor wall and the first conductive wall.

Semiconductor package devices having conductive layer, semiconductor wall, conductive wall, and insulation layer

Embodiments of the present disclosure describe a chemical replacement system and a method to automatically replace PR bottles. The chemical replacement system includes a computer system and a transfer module. The computer system can receive a request signal to replace one or more chemical containers and transmit a command to the transfer module. The transfer module, being controlled by the computer system, can include a holder configured to hold the one or more chemical containers (e.g., PR bottles); a door unit configured to open in response to the command; and a transfer unit configured to eject the holder in response to the command for replacement. The chemical replacement system can further include an automated vehicle configured to replace the one or more chemical containers in the ejected holder.

Chemical replacement system

The present disclosure describes a container for placing an object therein. The container includes a container body and a lid over the container body, a collision-preventing portion attached to one or more of the container body and the lid and configured to buffer an impact force, a pairing recognition mechanism configured to detect an object placed in the container body, and a liquid-detecting sensor configured to detect a leakage from the object.

Photoresist bottle container

The present disclosure discloses a wireless communication device and method capable of adaptively permitting packet transmission or adjusting a threshold for packet transmission. An embodiment of said wireless communication device includes a reception circuit, a control circuit and a transmission circuit. The reception circuit measures signal energy, generates multiple energy measurement values, and generates multiple comparison results according to the energy measurement values and at least a threshold. The control circuit is operable to generate a transmission control signal according to the comparison results or to its derived information. The transmission circuit, coupled to the reception circuit and the control circuit, determines whether packet transmission is allowable according to the comparison results if the transmission control signal indicates a normal state, and the transmission circuit determines whether packet transmission is allowable according to the transmission control signal if the transmission control signal indicates an abnormal state.

Wireless communication device and method

A tape out template system is provided. The tape out template system comprises a template database, a query database, and a processor. The template database stores a plurality of templates for mask tooling for different manufacturing technologies. Each of the templates comprises a set of mask tooling settings for different manufacturing processes of one of the manufacturing technologies. The query database stores a hierarchy of queries addressing differences among mask tooling information of the manufacturing processes. The processor receives technology information specifying the manufacturing technology of the tape out request, selects one of the templates according to the received technology information, selects and presents at least one of the queries according to the selected template, and determines values of the mask tooling settings according to the answers to the presented queries.

Growing community of inventors

Hsinchu, Taiwan

Yu Kai Chen