Industrial Technology Research Institute

Yu-Ju Kuo

Chyi-Ming Leu

Chun-Wei Su

Dong-Sen Chen

Chih-Cheng Lin

Hong-Ching Lin

Chun-An Lu

Chiung-Hsiung Chen

Yung-Lung Tseng

A polymer, a composition, and a polysiloxane-polyimide material thereof are provided. The polymer includes a first repeat unit and a second repeat unit. The first repeat unit has a structure represented by Formula (I) and the second repeat unit has a structure represented by Formula (II) wherein Aand Aare independently tetravalent moiety; Ais a divalent moiety; n&#x2265;1; m&#x2265;1; Ris independently hydrogen, Calkyl, Cfluoroalkyl, Calkoxy, or Caryl; and Ris independently hydrogen, Calkyl, Cfluoroalkyl, Calkoxy, Caryl, or a reactive functional group.

Polymer, composition, and polysiloxane-polyimide material thereof

A polyimide precursor solution is provided. The polyimide precursor solution includes 100 parts by weight of a fully aromatic polyamic acid, from 5 to 20 parts by weight of silica particles, from 5 to 80 parts by weight of an alkoxysilane, and from 40 to 80 parts by weight of a solvent.

Polyimide hybrid material, precursor solution and manufacture method thereof

A flexible substrate embedded with wires includes a flexible substrate constituted by a polymer material, and a continuous wire pattern containing a plurality of pores embedded in the flexible substrate, wherein the polymer material fills the pores. A method for fabricating a flexible substrate embedded with wires providing a carrier; forming a continuous wire pattern on the carrier, the continuous wire pattern containing a plurality of pores; covering a polymer material over the continuous wire pattern and the carrier and to fill into the pores; and separating the polymer material and the carrier to form a flexible substrate embedded with the continuous wire pattern' where the only change is the addition of wires.

Flexible substrate embedded with wires and method for fabricating the same

Disclosed is a substrate structure for manufacturing a flexible electronic device, including a supporting layer, a release layer covering the supporting layer with a first area, wherein the release layer is an aromatic polyimide, and a flexible layer covering the supporting layer and the release layer with a second area. The second area is greater than the first area. The adhesion force between the flexible layer and the supporting layer is stronger than the adhesion force between the release layer and the supporting layer.

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Yu-Ju Kuo