Big Bear Networks, Inc.

Yu Ju Chen

Hui Wu

Michael Zhong Xuan Wong

Thomas J Sleboda

An integrated high-speed package comprising a package housing having a housing lip and connector having a center pin abutting along a bottom surface of the housing lip. For signal registration of a first substrate to the signal lead, the substrate is &ldquo;floated&rdquo; up to the housing lip, which provides an alignment reference to ensure that the top surface of the first substrate is aligned and in direct registration with the signal lead. In another embodiment, the center pin to substrate registration is provided at a top surface of a housing base. The housing base preferably comprises a first portion of a first height and a second portion of a second height. Accordingly, the housing base can accommodate substrates of different thickness while allowing a top surface of the first and a second substrate to be coplanar to facilitate signal registration there between.

High-speed package design with suspended substrates and PCB

An apparatus and method for hermetically sealing, EMI shielding integrated circuits for high-speed electronic devices using a combination of microstrip to buried stripline interface for signal transmission from the integrated circuit. The packaging provided comprises a first plurality of microstrips interconnecting the integrated circuit to a plurality of buried striplines exposed on a surface of the main substrate. A ceramic interposer placed over the main substrate &ldquo;buries&rdquo; a portion of the exposed striplines on the main substrate to thereby insulate these signal paths from a hermetically sealing, and EMI shielding metal lid placed over the integrated circuit. The metal lid and the seal ring brazed over the ceramic interposer thus provide both a hermetic seal and an electric radiation block. A reduction in dispersion due to the buried striplines is also achieved, as well as improving jitter performance.

Growing community of inventors

San Ramon, CA, United States of America

Yu Ju Chen