Samsung Electro-mechanics Co., Ltd.

Yu Jong Kim

Young Do Choi

Tae Ryung Hu

Sung Min Moon

Jong Min Lee

Dong Min Kim

Cheol Soon Kim

Sang Seob Kim

Seung Hee Kim

Hye Yeon Jeon

Jong Ho Lee

Sung Woo Kim

Jae Yeol Choi

Young Sun Kim

Myung Jun Park

Sang Huk Kim

Jung Hyuk Jung

Dong Myong Kim

Dong Seob Lee

A coil electronic component includes a support substrate, a coil pattern disposed on the support substrate, an encapsulant encapsulating at least portions of the support substrate and the coil pattern, and external electrodes disposed externally on the encapsulant and connected to the coil pattern. The coil pattern includes a seed layer having a thickness of 1.5 μm or less and a plating layer disposed on the seed layer.

Coil electronic component

A coil electronic component includes a support substrate having a thickness of 20 to 40 μm. A coil pattern is disposed on at least one of a first surface and a second surface of the support substrate opposing each other, and has an aspect ratio of 4 or higher. An encapsulant encapsulates at least portions of the support substrate and the coil pattern, and an external electrode is disposed in an external region of the encapsulant and connected to the coil pattern.

A coil electronic component includes a support substrate, a coil portion disposed on at least one surface of the support substrate, a body in which the support substrate and the coil portion are embedded, and first and second external electrodes disposed on a surface of the body and connected to both ends of the coil portion, respectively. A thickness of the body is 0.55 mm or less. The body includes a cover portion disposed on the coil portion. A ratio of a thickness of the coil portion to a thickness of the cover portion is 5:5 to 8:2.

A coil electronic component includes a support substrate, a coil pattern disposed on at least one surface of the support substrate, and a lead-out pattern disposed on at least one surface of the support substrate and connected to the coil pattern. An encapsulant encapsulates at least portions of the support substrate, the coil pattern, and the lead-out pattern, and at least one protrusion protrudes from one side surface of the coil pattern. External electrodes are disposed externally on the encapsulant and connected to the lead-out pattern. The lead-out pattern is configured to extend in a thickness direction of the support substrate and to cover a side surface of the support substrate.

A coil component includes: a body including a support member including a through-hole, a first insulating layer supported by the support member and including a first opening portion, a second insulating layer disposed on the first insulating layer and including a second opening portion, and a coil including a coil pattern filled in the first and second opening portions; and external electrodes disposed on an outer surface of the body.

Coil component

An inductor includes: a body including a support member including a through-hole and a via hole, an insulator disposed on the support member and including a first opening exposing portions of the support member, and a coil pattern disposed in the first opening, and including a plurality of layers including a seed layer in contact with the support member; and an external electrode disposed on an external surface of the body and electrically connected to the coil pattern. The support member may have a multilayer structure of at least first and second insulating layers, and the via hole may penetrate through both of the first and second insulating layers.

Inductor and method of manufacturing the same

A coil component includes a body in which a coil part is embedded. The coil part includes a support member having trenches, pattern walls extending from the trenches in the support member, and coil patterns extending between the pattern walls on the support member.

Coil component and method for manufacturing the same

A coil component includes a body in which a coil part is embedded. The coil part includes a support member, pattern walls formed on the support member, and coil patterns extending between the pattern walls on the support member, and the pattern walls include support portions having a width greater than an average width of the pattern walls.

A coil component includes: a body including a support member including a through-hole, a first insulating layer disposed on the support member and including a first opening pattern, a second insulating layer disposed on the first insulating layer and including a second opening pattern, and a coil including a coil pattern filled in the first and second opening patterns; and external electrodes disposed on an outer surface of the body. The coil pattern has a stacking structure composed of a plurality of layers, and the plurality of layers includes a thin film conductor layer in contact with the support member, the thin film conductor layer extending to an entire lower surface of the first opening pattern and at least portions of side surfaces of the first opening pattern.

A multilayered ceramic capacitor including a ceramic body including a dielectric layer and having first and second main surfaces, first and second end surfaces, and first and second side surfaces; a first internal electrode having a first lead part; a second internal electrode having a second lead part; a first external electrode electrically connected to the first lead part and extending from the side surface having the first lead part exposed thereto, to at least one of the first and second main surfaces; a second external electrode electrically connected to the second lead part and extending from the side surface having the second lead part exposed thereto, to at least one of the first and second main surfaces; and an insulating layer covering the first and second external electrodes disposed on the first and second side surfaces.

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Suwon-si, South Korea

Yu Jong Kim