Taiwan Semiconductor Manufacturing Comp. Ltd.

Yu Jiang

Cheng-Yuan Tsai

Chung-Yi Yu

Sheng-Chau Chen

Sheng-Chan Li

Kuo Liang Lu

Chih Cheng Shih

Some implementations described herein include systems and techniques for fabricating a wafer-on-wafer product using a filled lateral gap between beveled regions of wafers included in a stacked-wafer assembly and along a perimeter region of the stacked-wafer assembly. The systems and techniques include a deposition tool having an electrode with a protrusion that enhances an electromagnetic field along the perimeter region of the stacked-wafer assembly during a deposition operation performed by the deposition tool. Relative to an electromagnetic field generated by a deposition tool not including the electrode with the protrusion, the enhanced electromagnetic field improves the deposition operation so that a supporting fill material may be sufficiently deposited.

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Taipei, Taiwan

Yu Jiang