Average Co-Inventor Count = 4.99
ph-index = 4
The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.
Company Filing History:
1. Taiwan Semiconductor Manufacturing Comp. Ltd. (17 from 40,635 patents)
17 patents:
1. 11961810 - Solderless interconnection structure and method of forming same
2. 11043462 - Solderless interconnection structure and method of forming same
3. 10319691 - Solderless interconnection structure and method of forming same
4. 10153243 - Semiconductor devices, methods of manufacture thereof, and packaged semiconductor devices
5. 10008459 - Structures having a tapering curved profile and methods of making same
6. 9966346 - Bump structure and method of forming same
7. 9953939 - Conductive contacts having varying widths and method of manufacturing same
8. 9917035 - Bump-on-trace interconnection structure for flip-chip packages
9. 9673125 - Interconnection structure
10. 9646923 - Semiconductor devices, methods of manufacture thereof, and packaged semiconductor devices
11. 9536850 - Package having substrate with embedded metal trace overlapped by landing pad
12. 9508668 - Conductive contacts having varying widths and method of manufacturing same
13. 9496233 - Interconnection structure and method of forming same
14. 9111817 - Bump structure and method of forming same
15. 9105530 - Conductive contacts having varying widths and method of manufacturing same