Fujifilm Corporation

Yu Iwai

Ichiro Koyama

Atsushi Nakamura

Akinori Shibuya

Takeshi Kawabata

Yoshitaka Kamochi

Hidekazu Oohashi

Junya Abe

Kazuhiro Fujimaki

Takafumi Nakayama

Mitsuru Sawano

Kazuto Kunita

Tomoya Sasaki

Yuriko Ishiguro

Takanori Mori

Kazuyoshi Mizutani

Kazuto Shimada

Toyohisa Oya

Norio Aoshima

Shota Suzuki

Yoshinori Taguchi

Masafumi Yoshida

Shiro Tan

Katsumi Araki

Koji Sonokawa

Ryuki Kakino

Kenta Yoshida

Takuma Amemiya

Pawel Malinowski

Junji Kawaguchi

Kei Fukuhara

Hideakzu Oohashi

Provided are a photosensitive resin composition in which the progress of cyclization reaction is fast and storage stability over time is excellent, a heterocyclic ring-containing polymer precursor, a cured film, a laminate, a method for producing a cured film, and a semiconductor device, using the photosensitive resin composition. The photosensitive resin composition includes a heterocyclic ring-containing polymer precursor selected from a polyimide precursor and a polybenzoxazole precursor, and a solvent, in which a solid content of the photosensitive resin composition has an amine value of 0.0002 to 0.0200 mmol/g.

Photosensitive resin composition, heterocyclic ring-containing polymer precursor, cured film, laminate, method for producing cured film, and semiconductor device

A photosensitive resin composition is also provided that includes a polymer precursor selected from a polyimide precursor and a polybenzoxazole precursor; a photo-radical polymerization initiator; and a solvent, in which an acid value of an acid group contained in the polymer precursor and having a neutralization point in a pH range of 7.0 to 12.0 is in a range of 2.5 to 34.0 mgKOH/g, and either the polymer precursor contains a radically polymerizable group or the photosensitive resin composition includes a radically polymerizable compound other than the polymer precursor.

Photosensitive resin composition, polymer precursor, cured film, laminate, method for producing cured film, and semiconductor device

Provided are a photosensitive resin composition in which warping of a cured film after curing is decreased and lithographic properties in a case of forming a pattern are excellent, a cured film, a laminate, a method for producing a cured film, and a semiconductor device. The photosensitive resin composition includes a polyimide precursor including a repeating unit including a biphenyl structure and a photopolymerization initiator having an oxime structure capable of generating an aryl radical by being irradiated with light.

Photosensitive resin composition, cured film, laminate, method for producing cured film, and semiconductor device

Provided is a laminate that excels in adhesion among a plurality of resin layers formed as insulating layers containing polyimide and so forth, a method for manufacturing the laminate, a semiconductor device, and, a method for manufacturing the semiconductor device. The laminate comprises a substrate, and at least two resin layers, each of the resin layers is independently brought into contact, in at least a part of the surface thereof, with other resin layer, and the layers independently has a Young's modulus exceeding 2.8 GPa and not exceeding 5.0 GPa, and, an elongation after fracture exceeding 50% and not exceeding 200%, and further has a three-dimensional radical crosslinked structure, and at least one of the resin layers contains at least either polyimide or polybenzoxazole.

Laminate, method for manufacturing laminate, semiconductor device, and method for manufacturing the semiconductor device

Provided are a kit and a laminate which are capable of suppressing residues derived from a temporary adhesive in manufacture of a semiconductor. The kit for manufacturing a semiconductor device includes a composition which contains a solvent A; a composition which contains a solvent B; and a composition which contains a solvent C, in which the kit is used when a temporary adhesive layer is formed on a first substrate using a temporary adhesive composition containing a temporary adhesive and the solvent A, at least some of an excessive amount of the temporary adhesive on the first substrate is washed using the composition containing the solvent B, a laminate is manufactured by bonding the first substrate and a second substrate through the temporary adhesive layer, one of the first substrate and the second substrate is peeled off from the laminate at a temperature of lower than 40&#xb0; C., and then the temporary adhesive remaining on at least one of the first substrate or the second substrate is washed using the composition containing the solvent C, and the solvent A, the solvent B, and the solvent C respectively satisfy a predetermined vapor pressure and a predetermined saturated solubility.

Kit and laminate

A photosensitive resin composition using a polyimide precursor composition, a cured film, a method for producing a cured film, a semiconductor device, and a method for producing a polyimide precursor composition are provided. In the polyimide precursor composition, the molar ratio of repeating units represented by General Formula (1-2) among structural isomers of the polyimide precursor is 60% to 90% by mole. In General Formula (1-2), Aand Aeach independently represents an oxygen atom or NH, Rand Reach independently represents a single bond or a divalent organic group, and Rand Reach independently represents a hydrogen atom or a monovalent organic group. 

Polyimide precursor composition, photosensitive resin composition, cured film, method for producing cured film, a semiconductor device, and method for producing polyimide precursor composition

Provided are photosensitive resin compositions having a wide exposure latitude, a precursor composition for providing such a photosensitive resin composition, a method for producing a precursor composition, a cured film, a method for producing a cured film; and a semiconductor device. The precursor composition is a precursor composition containing at least one kind of heterocycle-containing polymer precursor, in which the heterocycle-containing polymer precursor is selected from a polyimide precursor and a polybenzoxazole precursor; and the dispersity which is a weight-average molecular weight/a number-average molecular weight of the heterocycle-containing polymer precursor is 2.5 or more.

Precursor composition, photosensitive resin composition, method for producing precursor composition, cured film, method for producing cured film, and semiconductor device

Provided is a resin capable of yielding a cured film with less warp and good uniformity, and of yielding a cured film (pattern) with less scum; a composition using the resin; a cured film; and a method for manufacturing a cured film and a semiconductor device. The resin is selected from polyimide precursor, polyimide, polybenzoxazole precursor, and, polybenzoxazole, and has a polymerizable group, and has a total content of a component with a molecular weight of 1,000 or smaller of 0.005 to 1.0% by mass.

Resin, composition, cured film, method for manufacturing cured film and semiconductor device

Provided are a composition which has good elastomer solubility, is thus capable of increasing a concentration of solid contents, and is capable of forming a film having excellent drying properties, surface morphology, and heat resistance, a process for producing a sheet, a sheet, a laminate, and a laminate with a device wafer. This composition includes an elastomer having a 5% thermal mass reduction temperature of 375&#xb0; C. or higher when heated at an elevation rate of 20&#xb0; C./min from 25&#xb0; C., a solvent represented by the following General Formula (1) and having a boiling point of 160&#xb0; C. or higher, and a solvent having a boiling point of lower than 120&#xb0; C. In General Formula (1), Rto Reach independently represent a hydrogen atom or an aliphatic hydrocarbon group. 

Composition, process for producing sheet, sheet, laminate, and laminate with device wafer

A laminate includes, sequentially and adjacent to each other: a first base material; a temporary adhesion film; and a second base material, in which the tensile elastic modulus E of the temporary adhesion film at 25&#xb0; C. in conformity with JIS K 7161:1994 is in a range of 25 to 2000 MPa. A base material is peeled off by fixing any one of the first base material and the second base material of the laminate at 25&#xb0; C. and pulling an end portion of the other base material up in a direction perpendicular to the surface of the other base material from an interface with the temporary adhesion film at a speed of 50 mm/min, and the force applied during the pulling is measured using a force gauge and the value is 0.33 N/mm or less.

Laminate for treatment of a wafer device, temporary adhesion composition, and temporary adhesion film

A method is provided for photolithographic patterning of an organic layer, comprising: providing a shielding layer on the organic layer; providing a photoresist layer on the shielding layer; illuminating the photoresist layer through a shadow mask; developing the photoresist layer, thereby forming a patterned photoresist layer; performing a first dry etching step using the patterned photoresist layer as a mask, thereby removing at least an upper portion of the photoresist layer and completely removing the shielding layer at locations not covered by the photoresist layer; performing a second dry etching step using the patterned shielding layer as a mask, thereby removing the organic layer at locations not covered by the shielding layer; and removing the shielding layer, wherein removing the shielding layer comprises exposing it to water. A method of the present disclosure may advantageously be used in a process for fabricating organic semiconductor based devices and circuits.

Method for lithographic patterning of organic layers

A temporary bonding laminate for use in the manufacture of semiconductor devices and a method for manufacturing semiconductor devices are provided. A member to be processed (a semiconductor wafer or the like) can be temporarily supported securely and readily during a mechanical or chemical process of the member, and then the processed member can be readily released from the temporary support without damaging the processed member even after a high temperature process. The laminate includes: (A) a release layer and (B) an adhesive layer. The release layer contains (a1) a compound being liquid at 25&#xb0; C. and having a 5% mass reduction temperature of 250&#xb0; C. or more when measured in a nitrogen gas stream under heating conditions of a constant heating rate of 20&#xb0; C./min; and (a2) a binder having a 5% mass reduction temperature of 250&#xb0; C. or more when measured under the same conditions.

Temporary bonding laminates for use in manufacture of semiconductor devices and method for manufacturing semiconductor devices

Provided are a laminate which is capable of forming an excellent organic semiconductor pattern, a kit for manufacturing an organic semiconductor, which is used to manufacture such a laminate, and a resist composition for manufacturing an organic semiconductor, which is used for the kit for manufacturing an organic semiconductor. The laminate includes an organic semiconductor film, a protective film on the organic semiconductor film, and a resist film on the protective film, in which the resist film is formed of a photosensitive resin composition that contains a photoacid generator (A) which generates an organic acid of which a pKa of the generated acid is &#x2212;1 or less and a resin (B) which reacts with an acid generated by the photoacid generator so that the rate of dissolution in a developer containing an organic solvent is decreased.

Laminate, kit for manufacturing organic semiconductor, and resist composition for manufacturing organic semiconductor

There is provided a laminate body which is capable of forming an excellent pattern on an organic semiconductor. A laminate body includes at least a water-soluble resin film and a resist film formed of a chemically amplified photosensitive resin composition on a surface of an organic semiconductor film in this order, in which the chemically amplified photosensitive resin composition contains a photoacid generator which is decomposed in an amount of 80% by mole or greater when exposed to light under the condition of 100 mJ/cmor greater at a wavelength of 365 nm, a mask pattern is formed by an exposed portion being hardly soluble in a developer containing an organic solvent, and the formed mask pattern is used as an etching mask.

Laminate body

Provided is temporary bonding laminates for used in a manufacture of semiconductor devices, by which a member to be processed (a semiconductor wafer or the like) can be temporarily supported securely and readily during a mechanical or chemical process of the member to be processed and then the processed member can be readily released from the temporary support without damaging the processed member even after a high temperature process, and processes for manufacturing semiconductor devices. The temporary bonding laminate includes (A) a release layer and (B) an adhesive layer, wherein the release layer (A) comprises (a1) a first release layer having a softening point of 200&#xb0; C. or more and adjoining the adhesive layer (B), and (a2) a second release layer adjoining the first release layer (a1); the second release layer (a2) contains a resin; and the resin after curing has a capable of being dissolved at 5% by mass or more, at 25&#xb0; C., in at least one kind of solvents selected from hexane and the like.

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Shizuoka, Japan

Yu Iwai