Cheng Uei Precision Industry Co., Ltd.

Lite-On Technology Corporation

Lite-On Opto Technology (Changzhou) Co., Ltd.

Tci Co., Ltd.

Yu-Hung Su

Yao-Ting Wang

Shu-Hua Yang

Chin-Chou Wang

Hsin-Wei Tsai

Yun-Chien Lee

I-Ju Chen

Sheng-Tsung Yuan

Hou-Yen Tsao

Jyun Liao

Yung-Hsiang Lin

Sheng-Yuan Huang

Chun-Fu Lin

Pei-Yi Lin

Chin-Hsiu Yu

Yi-Ching Hsu

Wen Lee

Ning-lang Cheng

Yu-Ming Chung

Shan-Yu Lin

Hsiang-Chih Hung

Mei-Chuan Yang

Yung-Chi Peng

Chung-Hsin Huang

Chia-Cheng Wu

Chien-Tien Wang

Yeh-Ta Chien

Hsin-Tsung Ho

Chung-Yu Chen

Shu Man Chiang

Chung Hsin Huang

Yi Chiu Kao

Han-Hsing Peng

Jui-Lin Tsai

You-Chen Yu

Tai-Wen Tsai

Wen-Jie Tsou

Chia-tsung Lu

Da-Peng Lyu

Kuo Cheng Wang

Jian-Hua Huang

Ya-yun Cheng

Pai-Hao Chang

An electrical connector includes an insulating housing, an upper terminal assembly fastened in the insulating housing, a center grounding plate fastened in the insulating housing, and an outer shell disposed to a top surface of the insulating housing. A rear end of the insulating housing has two first penetrating grooves. The upper terminal assembly includes an upper base portion. A rear end of the upper base portion defines two second penetrating grooves. The two second penetrating grooves are aligned with the two first penetrating grooves. Two opposite sides of a rear end of a top surface of the outer shell extend towards the insulating housing to form two elastic arms, respectively. The two elastic arms pass through the two first penetrating grooves and the two second penetrating grooves, and then the two elastic arms contact with two outermost upper grounding terminals of the upper terminal assembly.

Electrical connector with high-frequency signal transmission

A high-speed connector includes an insulating housing, a first terminal assembly received in the insulating housing, a second terminal assembly received in the insulating housing, a third terminal assembly received in the insulating housing, and a fourth terminal assembly received in the insulating housing. The second terminal assembly is opposite to the first terminal assembly along an up-down direction. The third terminal assembly is disposed between the first terminal assembly and the second terminal assembly. The fourth terminal assembly is corresponding to the third terminal assembly. The fourth terminal assembly is disposed between the second terminal assembly and the third terminal assembly.

High-speed connector

A high-speed connector includes an insulating housing, and at least one terminal assembly disposed in the insulating housing. The at least one terminal assembly includes a base body, a plurality of terminals fastened to the base body, and a metal block. A surface of the base body is recessed inward to form a fastening groove. The plurality of the terminals include a plurality of grounding terminals and differential signal terminals. Each of the plurality of the grounding terminals and the differential signal terminals has a fastening portion. The fastening portions of at least several of the plurality of the grounding terminals and the differential signal terminals are exposed to the fastening groove. The metal block is fastened in the fastening groove. The fastening portions of the grounding terminals which are exposed to the fastening groove are electrically connected with the metal block to form a grounding structure.

Metal sheet

A light source device includes a substrate, a light emitting unit, a frame, a light permeable member, and a metal shield. An upper electrode layer and a lower electrode layer of the substrate are respectively disposed on two opposite sides of the substrate, and are electrically coupled to each other. The light emitting unit is disposed on the upper electrode layer. The frame is disposed on the substrate and is arranged around the light emitting unit. The light permeable member is disposed on the frame and covers the light emitting unit. The metal shield is fixed to an inner side of the frame and is connected to the ground pad of the upper electrode layer. The metal shield is arranged around the outer side of the light emitting unit.

Light source device

A light source package structure is provided. The light source package structure includes a substrate, an upper electrode layer, a surrounding wall, a light emitting unit, an adhesive, and a light permeable element. The surrounding wall is annular with step structure and includes an upper tread surface arranged away from the substrate, an upper riser surface connected to an inner edge of the upper tread surface, a lower tread surface disposed at an inner side of the upper riser surface, an accommodating groove disposed between the lower tread surface and the upper riser surface, and a lower riser surface connected to an inner edge of the lower tread surface and arranged away from the upper tread surface. The lower riser surface and the first surface jointly define a receiving space.

Light source package structure

A light source device includes a substrate, an electrode layer and an annular step-like surrounding frame both disposed on the substrate, a light emitter and a light detector both spaced apart from each other and mounted on the electrode layer in the surrounding frame, and a light permeable member disposed on the surrounding frame. The surrounding frame includes an upper tread arranged away from the substrate, an upper riser connected to an inner edge of the upper tread, a lower tread arranged at an inner side of the upper riser, and a lower riser connected to an inner edge of the lower tread and arranged away from the upper tread. The surrounding frame has a notch recessed in the lower tread and the lower riser for spatially communicating an inner side of the surrounding frame to an external space.

The light source device includes a substrate, a light emitting unit mounted on the substrate, a frame disposed on the substrate, a metal shield fixed to an inner side of the frame and electrically coupled to the substrate, a light permeable member disposed on the frame, a cover plate disposed on the light permeable member and fixed to the frame, a detection unit electrically coupled to the substrate, and an uplift block that provides for the substrate to be disposed thereon.

A light source package structure is provided. The light source package structure includes a substrate, an upper electrode layer, a light emitting unit, a photodiode, a surrounding wall, a light permeable element, and a coating layer. The substrate includes a first surface and a second surface that is opposite to the first surface. The upper electrode layer is disposed on the first surface of the substrate. The light emitting unit and the photodiode both are disposed on the upper electrode layer. The surrounding wall is disposed on the first surface and is arranged to surround the light emitting unit and the photodiode. The light permeable element is disposed on the surrounding wall. The coating layer is disposed inside of the surrounding wall and is coated on a part of the first surface and a part of the upper electrode layer.

A receptacle connector includes an insulating body, an isolation plate molded in the insulating body, a plurality of first terminals, a plurality of second terminals and an insulating housing. The plurality of the first terminals are molded in the insulating body. The insulating body has a plurality of limiting protrusions protruding downward from a lower surface of the insulating body. The plurality of the second terminals are mounted to the lower surface of the insulating body. The plurality of the second terminals are disposed corresponding to intervals of the plurality of the limiting protrusions. The insulating housing is molded outside the insulating body, the plurality of the first terminals, the plurality of the second terminals and the isolation plate.

Receptacle connector

A light source device includes a substrate, an upper electrode layer and a lower electrode layer respectively disposed on two opposite surfaces of the substrate, a plurality of first conductive posts and second conductive posts embedded in the substrate and having the same number, a light emitter, a surrounding frame surrounding the light emitter, and a light permeable member disposed on the surrounding frame and covering the light emitter. The first conductive posts connect a first upper electrode pad of the upper electrode layer and a first lower electrode pad of the lower electrode layer. The second conductive posts connect a second upper electrode pad of the upper electrode layer and a second lower electrode pad of the lower electrode layer. The light emitter is mounted on the first upper electrode pad and is electrically connected to the second upper electrode pad.

A method for at least one of increasing the synthesis of melatonin and promoting the secretion of melatonin is provided, wherein the method comprises administering to a subject in need an effective amount of a compound of formula (I): A method for at least one of treating diseases related to neurometabolic disorder, preventing diseases related to neurometabolic disorder, regulating appetite, regulating mood, regulating vasoconstriction, regulating hemostatic function and regulating immune response is also provided, wherein the method comprises administering to a subject in need an effective amount of a compound of formula (I) as described above.

Method of increasing melatonin synthesis to treat insomnia, ameliorate sleep disturbance and regulate sleep

A light source device includes a substrate, an upper electrode layer and a lower electrode layer both respectively disposed on two opposite surfaces of the substrate, a light emitting unit mounted on the upper electrode layer, a surrounding frame disposed on the substrate and surrounding the light emitting unit, a conductive unit disposed on the surrounding frame, a light permeable member disposed on the surrounding frame and covering the light emitting unit, and a detecting circuit formed on an outer surface of the light permeable member. The lower electrode layer includes two coplanar sub-layers. The light emitting unit is electrically coupled to one of the two sub-layers through the upper electrode layer. The detecting circuit includes two contacts connected to the conductive unit, and is electrically coupled to the second lower electrode sub-layer by the conductive unit electrically coupled to the other one of the two sub-layers.

A light source device and an electronic apparatus are provided. The light source device includes a substrate, an electrode layer and a surrounding frame disposed on the substrate, a light emitter and a light detector mounted on the electrode layer and located inside of the surrounding frame, and a light permeable member disposed on the surrounding frame and covering the light emitter and the light detector. When the light emitter receives a predetermined current so as to emit an invisible light toward the light permeable member, the light detector receives a reflected part of the invisible light to generate an initial photocurrent. When the light emitter receives a manipulation current so that a detection photocurrent generated from the light detector is less than a first proportion of the initial photocurrent or greater than a second proportion of the initial photocurrent, the light emitter stops receiving the manipulation current.

Light source device and electronic apparatus

A light source package structure is provided. The light source package structure includes a substrate, an upper electrode layer and a lower electrode layer respectively disposed on two sides of the substrate, a light emitting unit mounted on the upper electrode layer, a surrounding wall disposed on the substrate and arranged to surround the light emitting unit, a conductive unit disposed on the surrounding wall and electrically connected to the lower electrode layer, a light permeable element disposed on the surrounding wall, a detection circuit formed on the light permeable element, and at least one conductive adhesive. The conductive adhesive includes a colloid and a plurality of fillers mixed with the colloid. The colloid and the fillers of the conductive adhesive are partially filled within the gap.

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Taipei, Taiwan

Yu-Hung Su