Apple Inc.

Yu Hung Chen

Shih Chang Chang

Takahide Ishii

Yu-Wen Liu

Tsung-Ting Tsai

Ting-Kuo Chang

Abbas Jamshidi Roudbari

Shin-Hung Yeh

Andrew C Lin

Jae Won Choi

Lun Tsai

Ching-Sang Chuang

Chia-Yu Chen

Hung-Che Ting

Jung Yen Huang

Tsung-Hsiang Shih

Nai-Chih Kao

Chin Wei Hsu

Chih Pang Chang

Hsing-Chuan Wang

Fu-Yu Teng

Yu-Chuan Pai

Chang Ming Lu

Jianhong Lin

HanChi Ting

Sheng Hui Shen

Chuan-Sheng Wei

Kai-Chieh Wu

Chung-Wang Lee

A display may have organic light-emitting diode pixels formed from thin-film circuitry. The thin-film circuitry may be formed in thin-film transistor (TFT) layers and the organic light-emitting diodes may include anodes and cathodes and an organic emissive layer formed over the TFT layers between the anodes and cathodes. The organic emissive layer may be formed via chemical evaporation techniques. The display may include moisture blocking structures such as organic emissive layer disconnecting structures that introduce one or more gaps in the organic emissive layer during evaporation so that any potential moisture permeating path from the display panel edge to the active area of the display is completely terminated.

Organic light-emitting diode display panels with moisture blocking structures

A component such as a display may have a substrate and thin-film circuitry on the substrate. The thin-film circuitry may be used to form an array of pixels for a display or other circuit structures. Metal traces may be formed among dielectric layers in the thin-film circuitry. Metal traces may be provided with insulating protective sidewall structures. The protective sidewall structures may be formed by treating exposed edge surfaces of the metal traces. A metal trace may have multiple layers such as a core metal layer sandwiched between barrier metal layers. The core metal layer may be formed from a metal that is subject to corrosion. The protective sidewall structures may help prevent corrosion in the core metal layer. Surface treatments such as oxidation, nitridation, and other processes may be used in forming the protective sidewall structures.

Electrical components having metal traces with protected sidewalls

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Ping Chen, Taiwan

Yu Hung Chen