Everlight Electronics Co., Ltd.

United Microelectronics Corp.

Yu-Huan Liu

Chih-Jung Chen

Ssu-Yuan Weng

Chih-Chung Huang

Yao-Yu Yang

A phosphor composition and a white light emitting device using the same are disclosed. The white light emitting device includes a blue light emitting diode and a phosphor composition disposed on the blue light emitting diode, wherein the phosphor composition includes a yellow lanthanum silicon nitride, a yellow &#x3b2;-SiAlON and a red CaAlSiN, and the weight proportion of the yellow lanthanum silicon nitride, the yellow &#x3b2;-SiAlON and the red CaAlSiN is 1: 1:0.3&#x2dc;0.45.

Phosphor composition and white light emitting device using the same

A light-emitting diode (LED) and manufacturing method thereof are disclosed. The LED includes a transparent substrate, a plurality of transparent conductive layers, a plurality of metal circuits, and a LED chip. The LED chip is suitable for emitting a light and a portion of the light emits toward the transparent substrate. The manufacturing method of LED includes the following steps. First, a transparent conductive layer is formed on the transparent substrate. Next, a conductive pattern is formed by etching transparent conductive layer. The intersection metal circuit is formed by disposing the metal on a portion of the transparent conductive layer. Finally, the LED chip is disposed on the metal circuit so that the LED chip is electrically connected to the metal circuit.

Light-emitting diode mounted on intersected and discontinuous transparent conductive pattern layers and manufacturing method thereof

A light emitting diode package and a fabrication method thereof are provided. The light emitting diode package comprises a lead frame, having a frame body and a conductive layer covering the frame body. A reflector has a first portion and a second portion sandwiching the lead frame, wherein the first portion has a depression to expose the lead frame, and a light emitting diode chip is disposed on the lead frame in the depression. The fabrication method comprises forming a frame body and forming a conductive layer covering the frame body to form a lead frame. A first portion and a second portion of a reflector are formed to sandwich the lead frame, wherein the first portion has a depression to expose the lead frame. A light emitting diode chip is disposed on the lead frame in the depression.

Light emitting diode package and fabrication method thereof

A light emitting diode (LED) device including a transparent substrate, a plurality of LED chips, a circuit, and a transparent encapsulant is provided. The LED chips are fixed on the transparent substrate, and utilized for radiating at least a light beam. The circuit is disposed on the transparent substrate and electrically connected to the LED chips. The transparent encapsulant is utilized for packaging the LED chips. The light beam of the LED chips can propagate from two opposite sides of the transparent substrate. Blue LED chips and the circuit of the transparent substrate can be directly soldered, and the phosphors are arranged to convert the wavelength of blue light, so a dual-side white light emitting device can therefore be provided.

LED device and method of packaging the same

A method for forming a photoresist layer is provided. The method includes following steps. A wafer is provided in a semiconductor machine. The wafer is spun at a first spin speed. A pre-wet solvent is dispensed on the spinning wafer by using a nozzle disposed at a fixed position. The pre-wet solvent then stops dispensing. The spin speed of the wafer is adjusted from the first spin speed to a second spin speed which is faster than the first spin speed. Thereafter, a photoresist layer is coated on the wafer.

Growing community of inventors

Taipei, Taiwan

Yu-Huan Liu