Macronix International Co., Ltd.

Mosel Vitelic Corporation

Yu-Hua Yeh

Hua-Jen Tseng

Chun-Chieh Lee

Sheng-Feng Hung

Liang-Yu Hu

Tang-Tsai Chang

Ming-Tsan Lai

A planarization device and a planarization method using the same are provided. The planarization device comprises a platen, a grinding pad, an operation arm, a chuck and a shielding pad. The grinding pad is disposed on the platen. The operation arm has a lower surface. The chuck rotatably is disposed on the operation arm. The shielding pad is detachably disposed on the lower surface of the operation arm.

Planarization device and planarization method using the same

A plate-tilting apparatus adapted to be used in a semiconductor-manufacturing process is disclosed. The plate-tilting apparatus is used for preventing thin wafers from being collected in a cassette contacted with each other after the thin wafers are taken out of a solution. It includes a plate having the container locked thereon and having a first edge pivotally connected to a basal plane of a tank used in the semiconductor-manufacturing process, and a plate-lifting device connected to a second edge of the plate opposite to the first edge for lifting the second edge of the plate, so that the plate can be tilted at a specific angle.

Plate-tilting apparatus

Growing community of inventors

Hsinchu, Taiwan

Yu-Hua Yeh