Everlight Electronics Co., Ltd.

Powertech Industrial Co., Ltd.

Yu-Hsuan Chen

Yu-Lung Lee

Ming-Kuei Wu

A light emitting diode package structure including a base, a light emitting diode and an encapsulant is provided. The light emitting diode is disposed on a surface of the base and is adapted to generate and emit a light. The encapsulant is disposed on the base and encapsulates the light emitting diode. The encapsulant has a surface parallel to the surface of the base and a plurality of surfaces perpendicular to the surface of the base. The light, after passing through the surface of the encapsulant parallel to the surface of the base, has a first light intensity. The light, after passing through the surfaces of the encapsulant perpendicular to the surface of the base, has a second light intensity. The first light intensity is greater than the second light intensity. In addition, a manufacturing method of a light emitting diode package structure is also provided.

Light emitting diode package structure with large luminous intensity in particular directions and manufacturing method thereof

The present invention relates to a socket having rotary plug structure which comprises a housing and a rotary plug exposed outside the housing. At least a first socket is coupled to the rotary plug thereby allowing an electric equipment to be inserted. The rotary plug includes a rotation part and a ground pin fastened in the rotation part. A fasten pin is formed in the rotation part, wherein the distanced defined from the center point of the ground pin to the center point of the fasten pin is 38.9 mm&#xb1;10%. With the mentioned structure, the socket having rotary plug structure is enabled to be fastened onto a socket panel.

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Taipei, Taiwan

Yu-Hsuan Chen