Hon Hai Precision Industry Co., Ltd.

Hong-fu Jin Precision Industry (shenzhen) Co., Ltd.

Hongfujin Precision Industry (wuhan) Co., Ltd.

Scienbizip Consulting(shenzhen)co., Ltd.

Yu-Hsu Lin

Jeng-Da Wu

Chih-Hang Chao

Hui Zhang

Zhi-Ping Wu

Lei Guo

Liang-Liang Cao

Shang-Tsang Yeh

Lee-Ming Cheng

Guang-Feng Ou

Liang-Qing Shan

Chuan-Bing Li

Ming-Lun Szu

Robert G McHugh

Ning Liu

Wei Wei

Wei Zhang

Ke-You Hu

Hsiang-Ping Chen

Qin Li

Chun-Ming Chen

Chan-Fei Tai

Jian-Rong Zheng

Yun-Qiang Meng

Chuang-Bing Li

Wang-Jia Chen

Chao-Chen Huang

A printed circuit board includes a differential pair of transmission lines. The differential pair of transmission lines includes a first signal transmission line and a second signal transmission line. The first signal transmission line includes a first via and a second via. The second transmission line includes a third via and a fourth via. A first distance between a center of the first via and a center of the third via is equal to a first value. A second distance between a center of the second via and a center of the fourth via is equal to the first value. A third distance between the center of the first via and the center of the second via is equal to a second value. A fourth distance between the center of the third via and the center of the fourth via is not equal to the second value.

Printed circuit board with a differential line pair having vias in each line that are not equally spaced apart

An electronic device includes a wireless module, a power supply, and a switch module. The wireless module is adapted to receive or send a wireless signal. The power supply is adapted to supply power for the wireless module. The switch module is connected between the wireless module and the power supply, and the switch module includes a first switch and a transistor. A collector terminal of the transistor is coupled to the power supply, the first switch is coupled to the collector terminal and the base terminal of the transistor, and an emitter terminal of the transistor is coupled to the wireless module. The transistor is switched on when the first switch is switched on, and the power supply supplies power for the wireless module. The transistor is switched off when the first switch is switched off, and the power supply is disconnected from the wireless module.

Electronic device for activating and deactivating wireless communication by a power supply switch configuration

A printed circuit board includes an outer signal layer, a first ground layer, a first ground layer located below the outer signal layer, an inner signal layer located below the first ground layer, an second ground layer located below the inner signal layer, and a first differential signal transmission pair and a second differential signal transmission pair laid on the outer signal layer and the inner signal layer. A value h is equal to a distance between the inner signal layer and its closest ground layer. A distance between the first pair and the second pair is not more than h&#xd7;3.

Printed circuit board having differential line pairs with a percentage of their lengths disposed as an outer signal layer

A pair of signal transmission lines includes an aggressor line, a victim line, a first test pad, and a second test pad. The first test pad is in the aggressor line. The victim line is parallel to the aggressor line. A second test pad is in the victim line. The first test pad, on the aggressor line, is misaligned with the second test pad, on the victim line, to reduce the incidence and amplitude of any crosstalk generated.

Signal transmission lines with test pad

A testing system for testing a layout of a power pin of a chipset on a circuit board includes a layout information obtaining module, a power pin sorting module, a transmission line sorting module, a transmission line length calculating module, and a report generating module. The layout information obtaining module obtains layout information of the printed circuit board. The power pin sorting module sorts the power pin from a number of pins of the chipset. The transmission line sorting module sorts transmission lines that are connected to the power pin and are located on outer layers of the printed circuit board. The transmission line length calculating module calculates a total length of the transmission lines sorted by the transmission line sorting module and compares the total length with a threshold length. The report generating module generates a testing report indicating whether or not the power pin is qualified.

Computing device and method for testing layout of power pin of chipset on circuit board

A printed circuit board includes a signal layer having a pair of differential transmission lines thereon. An eye width and an eye height of an eye diagram obtained at output terminals of the pair of differential transmission lines are variable according to a distance between the pair of differential transmission lines. The eye width and the eye height of the eye diagram are at minimum values when the distance between the pair of differential transmission lines is at a first distance. The eye width and the eye height meet requirements of the pair of differential transmission lines for the eye diagram when the distance between the pair of differential transmission lines is set at a second distance, the second distance is less than the first distance.

Printed circuit board and layout method thereof

A printed circuit board layout method includes the following steps. A printed circuit board with a signal layer and a pair of differential transmission lines positioned on the signal layer is provided. A first distance is determined; when the distance between the pair of differential transmission lines is greater than the first distance, an eye width and an eye height of an eye diagram nearly remains the same. When a distance between the pair of differential transmission lines is less than the first distance, an eye width and an eye height of an eye diagram decreases. A second distance that is less than the first distance is set between the pair of differential transmission lines which makes the eye width and the eye height greater than a predetermined value, and which is determined by a Far End Crosstalk (FEXT) on the eye diagram when the pair differential transmission lines transmit signals.

Differential transmission line printed circuit board layout based on eye diagram parameters

A printed circuit board layout method includes the following steps. A printed circuit board with a signal layer, and a pair of differential transmission lines positioned on the signal layer is provided. A first distance is determined, when the distance between the pair of differential transmission lines is greater or less than the first distance, an eye width and an eye height of an eye diagram obtained at output terminals of the pair of differential transmission lines increases. A second distance less than the first distance is set between the pair of differential transmission lines which makes the eye width and the eye height meet requirement of the differential transmission lines for the eye diagram.

An electronic device enclosure for suppressing Electro-Magnetic Interference (EMI) includes a first plate defined on a first plane, a second plate defined on a second plane and a number of polygonal holes defined in the first plate at an angle of orientation. The second plane is substantially perpendicular to the first plane. The angle of orientation of the number of polygonal holes in the first plate is set according to a number of maximum dimensions in a direction substantially perpendicular to the second plane. The angle of orientation is defined such that there are a minimum number of maximum dimensions.

Electronic device enclosure with anti-EMI holes

A method for laying out a circuit board includes following steps. A substrate board is formed with a plurality of board sides. A ground plane, including a plurality of tiles, is provided. Each ground trace tile is defined by a plurality of ground traces. A signal plane on the substrate board has a plurality of signal traces that comprise of a plurality of straight line segments. Any one ground trace of each tile is arranged at an angle other than zero degrees relative to one determined board side. The straight line segments is applied to be mapped on the ground plane crossing one ground trace of one tile within an angle range determined by the ground traces of the tile and an adjacent diagonal line of the tile. The one ground trace and the straight line segments are applied at an angle movable in a range from 22.5&#xb0; to 32.5&#xb0;.

Circuit board layout method

A circuit board includes an insulation layer, a signal layer disposed on one side of the insulation layer, and a ground plane and a power plane disposed on the insulation layer at a side opposite to the signal layer. The insulation layer forms a separating area arranged between the ground plane and the power plane. At least two signal traces parallel to each other are arranged on the signal layer at one side corresponding to one of the ground plane and the power plane. A width of the signal trace close to the separating area is wider than that of the signal trace away from the separating area.

Circuit board

A motherboard includes a printed circuit board, a first chip and a second chip arranged on the printed circuit board in parallel. A plurality of securing holes are defined in the printed circuit board around the first chip. At least one isolating hole is defined in the printed circuit board between the second chip and a first line determined by two of the securing holes close to the second chip. Should the printed circuit board suffer an impact, damage to the chips may be effectively minimized or prevented.

Motherboard

A printed circuit board includes a ground layer and a signal layer. The ground layer has a grid formed by grid lines. A pair of signal traces is laid on the signal layer. The pair of signal traces is symmetrical about one grid line or one central line of the grid.

Printed circuit board

A heat dissipation apparatus includes a heat sink configured to contact a heat source, and a fan mounted on the heat sink configured to generate airflow through the heat dissipation apparatus. The fan includes a plurality of fan blades, and a motor configured for rotating the fan. The motor is located a distance from the fan blades.

Heat dissipation apparatus

A printed circuit board includes a base and a signal trace laid on the base. The signal trace includes a plurality of straight line segments parallel to the first fibers. The signal trace is laid on the base in such a manner that the line segments of the signal trace mapped on the base partly superpose the first fibers and partly superpose gaps between two adjacent first fibers.

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San Jose, CA, United States of America

Yu-Hsu Lin