Walsin Advanced Electronics Ltd.

Yu-Hsien Su

Chien-Hung Lai

Chun-Jen Su

Chao-Chia Chang

Chien-Tsun Lin

Ming-Hui Tseng

A semiconductor package is disclosed, such as QFN, SON. The semiconductor package includes a die, a package body for protection of a die, and a plurality of leads. A metal pad formed by some partial downside surface of each lead is located on a downside surface of the package body with coplanarity. Each lead has a cutting surface exposed on a corresponding lateral surface of the package body. The cutting surface has an interval with the plane of forming the metal pads by means of selectively self-etching the leads or stamping to bend the leads in order to avoid forming a cutting sharp edge in the brim of the metal pad after cutting.

Growing community of inventors

Kaohsiung, Taiwan

Yu-Hsien Su