Advanced Semiconductor Engineering, Inc.

Yu-Hsiang Sun

Kuo-Hsien Liao

Jian-Cheng Chen

Chanyuan Liu

Chi-Hong Chan

Chian-Her Ueng

A semiconductor device package and a fabrication method thereof are disclosed. The semiconductor package comprises: a substrate having a first face and an opposing second face, wherein the first face is mounted with a first semiconductor component and a plurality of connectors; and a first shielding member covering the first semiconductor component and a first group of the plurality of connectors, while exposing a second group of the plurality of connectors.

Semiconductor device package

The semiconductor device package includes a conformal shield layer applied to the exterior surface of the encapsulant, and an internal fence or separation structure embedded in the encapsulant. The fence separates the package into various compartments, with each compartment containing at least one die. The fence thus suppresses EMI between adjacent packages. The package further includes a ground path connected to the internal fence and conformal shield.

Growing community of inventors

Kaohsiung, Taiwan

Yu-Hsiang Sun