Lg Innotek Co., Ltd.

Lg Electronics Inc.

Lg Innotekco., Ltd.

Lg Innotek

Yu Ho Won

Geun Ho Kim

Yong Seon Song

Geun-Ho Kim

Seung Yeob Lee

Yong Suk Kim

Chil Keun Park

Ki Chang Song

Hoon Hurh

Guen-Ho Kim

Kwang Suk Park

A light emitting device that includes a conductive substrate, an insulating layer on the conductive substrate, a plurality of light emitting device cells on the insulating layer, a connection layer electrically interconnecting the light emitting device cells, a first contact section electrically connecting the conductive substrate with at least one light emitting device cell, and a second contact section on the at least one light emitting device cell.

Light emitting device and method for fabricating the same

A light emitting device package includes substrate; first and second conduction members on the substrate; a light emitting diode on the substrate, the light emitting diode being electrically connected with the first and second conduction members; and a phosphor layer on the light emitting diode.

Light emitting device and method of fabricating the same

A light emitting device package includes a substrate having a first cavity and a second cavity directly under the first cavity, a light emitting part on the second cavity, a first metal layer on an inner side surface of the substrate, a second metal layer on the inner side surface of the substrate, a third metal layer on a bottom surface of the substrate, the third metal layer electrically connected to the first metal layer by a first via hole, a fourth metal layer on the bottom surface of the substrate, the fourth metal layer electrically connected to the second metal layer by a second via hole, and a fifth metal layer on the bottom surface of the substrate, the fifth metal layer disposed between the first via hole and the second via hole.

Light emitting device package including a substrate having at least two recessed surfaces

A light emitting device package according to embodiments comprises: a package body; a lead frame on the package body; a light emitting device supported by the package body and electrically connected with the lead frame; a filling material surrounding the light emitting device; and a phosphor layer comprising phosphors on the filling material.

Light emitting device package

A light emitting device package is disclosed, which includes a first via hole and a second via hole disposed lower than a light emitting part, the first via hole and the second via hole are disposed at an outer area of the light emitting part, a bottom metal includes a first bottom metal, a second bottom metal, and a third bottom metal between the first bottom metal and the second bottom metal, a first conductive metal electrically connected to the first bottom metal through the first via hole and a second conductive metal electrically connected to the second bottom metal through the second via hole. Further, the first bottom metal, the second bottom metal are apart from the third bottom metal at a bottom surface of the substrate, and the third bottom metal is not electrically connected to the second conductive type metal layer.

A light emitting device package capable of emitting uniform white light and a method for manufacturing the same are disclosed. The light emitting device package includes a package body, an electrode formed on at least one surface of the package body, a light emitting device mounted on the package body, and a phosphor layer enclosing the light emitting device while having a uniform thickness around the light emitting device.

Light emitting device package and method for manufacturing the same

Disclosed is a light emitting device package. The light emitting device package includes a substrate including a recess, a light emitting chip on the substrate and a first conductive layer electrically connected to the light emitting chip. And the first conductive layer includes at least one metal layer electrically connected to the light emitting chip on an outer circumference of the substrate.

A light emitting device package comprises a substrate, an electrode on the substrate, a light emitting device on the substrate and electrically connected to the electrode layer, and a pattern enclosing the light emitting device.

Light emitting device package and method for fabricating the same

Disclosed is a light emitting device package. The light emitting device package includes a substrate comprising a recess, a light emitting chip on the substrate and a first conductive layer electrically connected to the light emitting chip. And the first conductive layer includes at least one metal layer electrically connected to the light emitting chip on an outer circumference of the substrate.

A light emitting device package capable of achieving an enhancement in light emission efficiency and a reduction in thermal resistance, and a method for manufacturing the same are disclosed. The method includes forming a mounting hole in a first substrate, forming through holes in a second substrate, forming a metal film in the through holes, forming at least one pair of metal layers on upper and lower surfaces of the second substrate such that the metal layers are electrically connected to the metal film, bonding the first substrate to the second substrate, and mounting at least one light emitting device in the mounting hole such that the light emitting device is electrically connected to the metal layers formed on the upper surface of the second substrate.

Provided are a light emitting device package and a method for fabricating the same. The light emitting device package comprises a substrate; a light emitting device on the substrate; a zener diode comprising a first conductive type impurity region and two second conductive type impurity regions, the first conductive type impurity region being disposed in the substrate, the two second conductive type impurity regions being separately disposed in two areas of the first conductive type impurity region; and a first electrode layer and a second electrode layer, each of them being electrically connected to the second conductive type impurity regions and the light emitting device.

A light emitting device package comprises: a substrate; first and second conduction members on the substrate; a light emitting diode on the substrate, the light emitting diode being electrically connected with the first and second conduction members; and a phosphor layer on the light emitting diode.

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Seoul, South Korea

Yu Ho Won