Taiwan Semiconductor Manufacturing Comp. Ltd.

Yu-Heng Cheng

Chi-Cherng Jeng

Volume Chien

Fu-Tsun Tsai

Chih Hung Chen

Shich-Chang Suen

Chi-Hsiang Shen

Te-Chien Hou

Huan-En Lin

Hsi-Jung Wu

A chemical mechanical polishing device is provided according to some embodiments. The chemical mechanical polishing device comprises a polishing pad. The polishing pad includes a plurality of stacks of first pad fractions and a plurality of stacks of second pad fractions. The first pad fractions and the second pad fractions have different hardness. The stacks of first pad fractions and the stacks of the second pad fractions are arranged with a pattern corresponding to a predetermined feature of a structure to be polished by the chemical mechanical polishing device. The predetermined feature may include a surface profile or a material of the structure to be polished.

Semiconductor device fabrication methods and devices for forming the same

Embodiments of the disclosure provide an image sensor device. The image sensor device includes a semiconductor substrate. The semiconductor substrate has a front surface, a back surface opposite to the front surface, a light-sensing region close to the front surface, and a trench adjacent to the light-sensing region. The image sensor device includes a reflective layer positioned on an inner wall of the trench, wherein the reflective layer has a light reflectivity ranging from about 70% to about 100%.

Image sensor device and method for forming the same

An integrated circuit structure includes a semiconductor substrate, an image sensor extending from a front surface of the semiconductor substrate into the semiconductor substrate, and an isolation structure extending from a back surface of the semiconductor substrate into the semiconductor substrate, wherein the isolation structure includes an air-gap therein. An air-gap sealing layer is on a backside of the semiconductor substrate. The air-gap sealing layer seals the air-gap, wherein the air-gap sealing layer includes a portion exposed to the air-gap.

Deep trench isolation with air-gap in backside illumination image sensor chips

Growing community of inventors

Lukang, Taiwan

Yu-Heng Cheng