IV Technologies Co., Ltd.

Yu-Hao Pan

Kun-Che Pai

Yu-Piao Wang

Ching-Huang Shen

Chung-Ru Wu

Chun-Ming Ting

Geng-I Lin

A polishing layer is provided. The polishing layer have a surface pattern, a cross section of the surface pattern along a direction has a plurality of grooves and a plurality of polishing portions, each of the grooves is disposed between every two adjacent polishing portions, and the polishing layer comprises a body layer and a surface layer. The surface layer is disposed on a surface of the body layer, and a top of at least one of the polishing portions has at least one flattened region exposing the body layer.

Polishing layer and polishing method

A polishing pad is provided. The polishing pad, disposed on a polishing platen and suitable for a polishing process, includes a polishing layer, an adhesive layer and at least one adhesion-reducing interface layer. The adhesive layer is disposed between the polishing layer and the polishing platen. The at least one adhesion-reducing interface layer is disposed between the adhesive layer and the polishing layer and/or disposed between the adhesive layer and the polishing platen. An area of the at least one adhesion-reducing interface layer is smaller than an area of the adhesive layer.

Polishing pad and polishing method

A manufacturing method of a polishing layer is provided. First, a mold for which the mold cavity has a contour pattern is provided, and the cross section of the contour pattern along a direction includes a plurality of recessions and at least one concavity portion, wherein the at least one concavity portion is disposed on the bottom of at least one of the recessions. A polymer material is disposed in the mold cavity. The polymer material is cured to form a semifinished product, wherein the cross section of the semifinished product along the direction includes a plurality of polishing portions corresponding to the recessions and at least one protruding portion corresponding to the at least one concavity portion. A flattening process is performed on the semifinished product to remove the at least one protruding portion.

Manufacturing method of polishing layer, and polishing method

A base layer, a polishing pad with a base layer and a polishing method are provided. The polishing pad includes a polishing layer and a base layer. The base layer, underlaid below the polishing layer, is a three-dimensional fabric. The three-dimensional fabric comprises a top woven layer, a bottom woven layer, and a supporting woven layer disposed between the top woven layer and the bottom woven layer. The top woven layer and the bottom woven layer are respectively woven by a plurality of first set of yarns and a plurality of second set of yarns. The supporting woven layer comprises a plurality of supporting yarns interconnecting the top woven layer and the bottom woven layer, so that a space exists between the top woven layer and the bottom woven layer.

Base layer, polishing pad with base layer, and polishing method

A polishing layer of a polishing pad is provided. The polishing layer of the polishing pad includes a carrier layer and a plurality of embedded sections. The embedded sections embedded in the carrier layer are located in a polishing surface of the polishing layer, wherein in the polishing surface of the polishing layer, a groove is included in the carrier layer between every two adjacent embedded sections.

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Taichung, Taiwan

Yu-Hao Pan