Faraday Technology Corporation

Taiwan Semiconductor Manufacturing Comp. Ltd.

Yu-Hao Liu

Sheng-Hua Chen

Cheng-Hsing Chien

Tze-Chiang Huang

King-Ho Tam

Disclosed herein are related to an integrated circuit including multiple dies stacked along a direction. In one aspect, the integrated circuit includes a first die, a second die, and a third die stacked along the direction. In one aspect, the first die includes a first interface circuit to generate a signal. In one aspect, the second die includes a second interface circuit to receive the signal from the first interface circuit and generate a replicate signal of the signal. In one aspect, the third die includes a third interface circuit to receive the replicate signal from the second interface circuit.

Die to die interface circuit

A true single-phase clock (TSPC) D flip-flop includes four stages. The four stages are serially connected between the input terminal and the output terminal of the TSPC D-type flip-flop. Each stage is selectively equipped with two connecting devices. One of the two connecting devices is a resistive element. The other of the two connecting devices is a short circuit element. When the node between two stages is in the floating state, the voltage change is slowed down by the resistive element. Consequently, the possibility of causing the function failure of the D-type flip-flop is minimized.

Growing community of inventors

Hsinchu, Taiwan

Yu-Hao Liu