Wistron Neweb Corporation

Yu-Fu Kuo

Shih-Hong Chen

Babak Radi

Yuan-Chin Hsu

Tzu-Wen Chuang

Chien-Ming Peng

Chao-Chun Lin

Tzu-Min Wu

Chun-Lin Chen

Tzuh-Suan Wang

Wen-Pin Ho

Chih-Yung Shih

Jing-Jing Gong

Hsiao-Fang Liu

Jing-Wen Chen

Sun-Hua Chang

Antenna bracket

An antenna array device and an antenna unit thereof are provided. The antenna unit includes an antenna structure and a molding support. The antenna structure includes a substrate and a plurality of patches that are formed on the substrate. The substrate has a plurality of channel holes penetrating there-through. The molding support is integrally formed on the substrate as a single one-piece structure. The molding support has a first stand, a second stand, and a plurality of connection portions that are formed in the channel holes to connect the first stand and the second stand. The first stand and the second stand are formed on two sides of the substrate, respectively.

Antenna array device and antenna unit thereof

A shielding structure and a manufacturing method thereof are provided. The shielding structure includes a metal housing, a plastic member, and a conductive trace. The metal housing has an inner surface and an internal space. The plastic member is disposed on the inner surface and in the internal space and has an accommodating space. The conductive trace is disposed on the plastic member and in the accommodating space, wherein the plastic member is between the conductive trace and the metal housing.

Shielding structure and manufacturing method thereof

A sensing module and an electronic device are provided. The sensing module includes a substrate, at least one light-emitting unit, a light-guiding assembly, at least one sensing circuit structure, and a sensing processor. The light-guiding assembly is connected to the substrate and includes at least one light-guiding structure. The at least one light-emitting unit is configured to emit a light beam outwardly through the at least one light-guiding structure. One end of the at least one sensing circuit structure is disposed on the substrate. The sensing processor is disposed on the substrate, and is configured to sense a capacitance change in a peripheral area of the at least one sensing circuit structure by the at least one sensing circuit structure and to generate a sensing signal. The sensing processor or an external controller is configured to control the at least one light-emitting unit according to the sensing signal.

Sensing module and electronic device

The present disclosure is directed to a method of fabricating a substrate structure and a substrate structure fabricated by the same method. The method would include forming a first metal layer directly on a base, forming a first protective layer directly on the first metal layer, forming a second protective layer by using a compound comprising a thiol group directly on the first protective layer, patterning the second protective layer to form a pattern having an opening exposing the first protective layer, and forming a second metal layer within the opening of the second protective layer and directly on the first protective layer. The substrate structure would include a base, a first metal layer, a first protective layer, a second protective layer, and a second metal layer.

Method of fabricating substrate structure and substrate structure fabricated by the same method

A metal pattern formed in the electromagnetic absorber structure is provided. By performing the laser treatment to form the active layer thereon, the metal pattern can be regionally formed on the electromagnetic absorber structure in the following electroless plating processes.

Metal pattern on electromagnetic absorber structure

A method of forming a metallic pattern on a polymer substrate is provided. A mixture layer is formed on a polymer substrate surface. The mixture layer includes an active carrier medium and nanoparticles dispersed in the active carrier medium. A laser process is performed to treat a portion of the mixture layer to form a conductive pattern on the surface of the polymer substrate. A cleaning process is performed to remove an untreated portion of the mixture layer to expose the surface of the polymer substrate, while the conductive pattern is remained on the surface of the polymer substrate. Then, the conductive pattern on the polymer substrate is subjected to an electroplating process to form the metallic pattern over the conductive pattern on the polymer substrate.

Method of forming metallic pattern on polymer substrate

A method of forming a metallic pattern on a polymer substrate is provided. A mixture layer is formed on a polymer substrate surface. The mixture layer includes an active carrier medium and nanoparticles dispersed in the active carrier medium. A laser process is performed to treat a portion of the mixture layer to form active seed residues on the surface of the polymer substrate. A cleaning process is performed to remove an untreated portion of the mixture layer to expose the surface of the polymer substrate, while the active seed residues are remained on the surface of the polymer substrate. Then, the active seed residues on the polymer substrate are subjected to an electroless plating process to form the metallic pattern over the active seed residues on the polymer substrate.

A method for manufacturing an antenna structure is disclosed. Employing steps of mixing with a catalyst and embedding a metal insert can simplify steps for manufacturing the antenna structure. Further, a non-conductive frame produced by the process disclosed herein can exhibit waterproof effect. The catalyst mentioned above is mixed with a plastic and then injected into a mold to form the non-conductive frame. The metal insert mentioned above is disposed in the mold before the step of injecting the plastic. Alternatively, the metal insert is embedded in the non-conductive frame after the step of injecting the plastic.

Growing community of inventors

Hsinchu, Taiwan

Yu-Fu Kuo