Stats Chippac Pte. Ltd.

Yu Feng Feng

Chee Keong Chin

Jae Hak Yee

Guo Qiang Shen

Frederick Cruz Santos

Wen Bin Qu

An integrated circuit package-in-package system is provided including mounting first integrated circuits stacked in a first offset configuration over a die-attach paddle having a first edge and a second edge, opposing the first edge; connecting the first integrated circuits and a second edge lead adjacent the second edge; mounting second integrated circuits stacked in a second offset configuration, below and to the die-attach paddle; connecting the second integrated circuits and a first edge lead adjacent to the first edge; and encapsulating the first integrated circuits, second integrated circuits, and the die-attach paddle, with the first edge lead and the second edge lead partially exposed.

Integrated circuit package-in-package system housing a plurality of stacked and offset integrated circuits and method of manufacture therefor

An integrated circuit package system includes a bottom lid, a base integrated circuit over the bottom lid, and a top lid with an integrated circuit window opening over the bottom lid.

Integrated circuit package system with window opening

An integrated circuit package system includes: providing a base package of an elongated rectangular-box shape containing first electrical circuitry and including: forming a rectangular contact strip on and adjacent to a first end of the base package; and forming a base contact pad on and adjacent to a second end of the base package for connection to an electrical interconnect.

Growing community of inventors

Shanghai, China

Yu Feng Feng