Taiwan Semiconductor Manufacturing Comp. Ltd.

Global Unichip Corporation

Yu-Fang Hsia

Ling-Chih Chou

Yu-Ru Chang

A multi-layer substrate structure to achieve multiple arrangements of power/ground domains is disclosed. The multi-layer substrate structure comprises a first layer for disposing an integrated circuit thereon and a second layer coupled to the first layer, wherein a connection structure is electrically connected to a plurality of power/ground domains on the second layer. With different combinations of the sawing lines and keep-out regions on the multi-layer substrate structure for cutting off some portions of the connection structure, the invention can achieve multiple arrangements of power/ground domains without impacting the customer's PCB or system board design so as to cut short the cycle time for engineering development phase.

Substrate structure and the process manufacturing the same

The present invention discloses a package substrate layout design to achieve multiple substrate functions for engineering development and verification. The substrate layout contains a connection structure to connect to a plurality of power/ground domains on the package substrate. With different combination of the cutting lines on the package substrate, the invention can achieve multiple substrate functions without impacting the customer's PCB or system board design and provide cost effective and fast cycle time for engineering development phase.

Growing community of inventors

Hsinchu, Taiwan

Yu-Fang Hsia