Industrial Technology Research Institute

Yu-Chung Lin

Min-Kai Lee

Sung-Ho Liu

Chien-Jung Huang

Pin-Hao Hu

Hsin-Yu Chang

Fu-Lung Chou

Cheng-Huan Chen

Chun-Ming Chen

Chih-I Wu

Shih-Ming Lin

Ying-Hui Yang

Mao-Chi Lin

Chieh-Ting Tseng

A method of fabricating a substrate having a through via includes: providing a carrier board having a release layer thereon; attaching the substrate onto the carrier board via the release layer; applying a light beam to the substrate to form a first blind hole in the substrate, wherein the first blind hole penetrates a first surface and a second surface of the substrate; performing an enlargement process on the first blind hole to form a second blind hole; forming a through via in the second blind hole; and performing a de-bonding process to release the substrate having a through via from the carrier board.

Substrate having through via and method of fabricating the same

A cutting method for forming a chamfered corner includes a step of selecting a light pattern-adjusting module according to a pre-cut chamfer angle, a step of the light pattern-adjusting module emitting a laser beam to a substrate and thus forming a modified region extending in a thickness direction at the substrate, a step of the light pattern-adjusting module adjusting an axial energy distribution of a light pattern of the laser beam to vary an appearance of the modified region so as to form the modified region fulfilling the pre-cut chamfer angle, and a step of etching the substrate having the modified region to form a chamfered surface on the substrate by cutting the modified region from the substrate.

Cutting method for forming chamfered corners

A laser cleaning apparatus and a laser cleaning method are furnished, for switching the wavelengths of laser beams furnished by a single laser module using a wavelength switching module and cleaning a test piece using the laser beams having wavelengths and energy suitable for manufacturing needs. The laser cleaning method includes: creating a laser beam; switching the wavelength output by the laser based on process requirements; propagating the laser beam via an optical path propagating module for laser cleaning the test piece; and removing debris. A transfer platform allows movements of the laser beams with respect to the test piece to achieve cleaning of the entire test piece. A control module controls the wavelength switching unit, the laser beam regulating module, and the transfer platform. Total laser cleaning with improved laser cleaning quality is achieved by using these laser beams with the appropriate wavelengths and energy.

Laser cleaning apparatus and laser cleaning method

A laser uniformly machining apparatus and method thereof are provided. The apparatus includes a laser unit, a shaping element, a collimating element, a scaling element and a focusing element. The laser unit provides a laser beam for machining. The shaping element shapes the laser beam into an annular beam. The collimating element modifies the direction of the annular beam in accordance with the direction of an optical axis to turn the annular beam into a collimated annular beam. The scaling element adjusts the collimated annular beam in accordance with a scaling ratio to produce a scaled annular beam. The focusing element focuses the scaled annular beam. The scaled annular beam is produced by the scaling element to form a focused beam having a uniformly distribution of light intensity in the direction of the optical axis.

Laser uniformly machining apparatus and method

A beam diffusing module including a light incident terminal, a light emitting terminal, a first reflective plate and a second reflective plate is provided. The first reflective plate and the second reflective plate are disposed on a transmission path of a laser beam. At least one of the first reflective plate and the second reflective plate has a plurality of reflective micorstructures. The reflective micorstructures are arranged along a second direction from the light incident terminal towards the light emitting terminal. At least a part of the laser beam enters the beam diffusing module through the light incident terminal and emerges from the light emitting terminals after being reflected repeatedly by the first reflective plate and the second reflective plate to cause an M squared of the laser beam to be redistributed along a first direction. A beam generating system is also provided.

Beam diffusing module and beam generating system

A beam generating apparatus includes a laser light source, a speckle suppressing module, a light homogenizing module and a driving unit. The laser light source outputs a laser beam. The speckle suppressing module includes two biconic lenses and a diffuser. The first biconic lens is disposed on a transmission path of the laser beam. The diffuser is located on the transmission path of the laser beam between the first and second biconic lenses. The light homogenizing module is disposed on the transmission path of the laser beam from the second biconic lens. The driving unit drives the diffuser to move with respect to the laser beam so that the ratio of the Mof the laser beam exiting from the second biconic lens in a first direction to the Mthereof in a second direction is greater than 2, wherein the two directions are substantially perpendicular to each other.

Beam generating apparatus

A laser scanning device includes a laser output unit, a scanner, a light splitting unit, an imaging compensation unit, a detection unit, and a control unit. A scanning focusing unit included in the scanner focuses a laser beam emitted by the laser output unit to scan an object. A visible light beam received by the canning focusing unit is reflected by the light splitting unit and is incident into the imaging compensation unit. Next, the detection unit receives the visible light beam passing through the imaging compensation unit, and outputs a detection signal. The control unit adjusts the detection signal according to the wavelength of the visible light beam, the wavelength of the laser beam, the scanning focusing unit, and the imaging compensation unit. Therefore, the laser scanning device may compensate the aberration and the dispersion caused when the visible light beam passes through the scanning focusing unit.

Laser scanning device

A laser scanning device and a method using the same are provided. The laser scanning device includes a laser output unit, a shape rotation unit, a scanning unit and a control unit. The laser output unit is used to output a laser beam. The shape rotation unit is disposed on a propagation path of the laser beam for rotating a spot of the laser beam by a predetermined angle. The scanning unit receives the laser beam whose spot has been rotated by the predetermined angle to scan a work piece set on a carrier unit. The control unit is set between the shape rotation unit and the scanning unit for generating the predetermined angle based on a scanning position of the scanning unit.

Growing community of inventors

Tainan, Taiwan

Yu-Chung Lin