Unimicron Technology Corporation

Yu-Chung Hsieh

Chun-Hsien Chien

Yu-Hua Chen

Hsin-Hung Lee

Wei-Ti Lin

Hsuan-Yu Lai

Tzyy-Jang Tseng

Ying-Chih Chan

Chun-Ting Lin

Ying-Tung Wang

Hung-Pin Yu

Yi-Hsiu Fang

An inspection system and an inspection method of a bare circuit board are provided. The inspection system is used for inspecting a bare circuit board. The bare circuit board includes a chip pad and an antenna. The inspection system includes an adapter board, a test device and a measure device. The adapter board includes a chip and a contact structure. The chip is electrically connected to the contact structure. The contact structure touches the chip pad so that the chip is electrically connected to the chip pad. The test device includes a transceiver antenna. The test device and the bare circuit board separate. The measure device is electrically connected to the chip or the transceiver antenna.

Inspection system and inspection method of bare circuit board

A bare circuit board is provided, in which the bare circuit board includes a substrate, an antenna, a chip pad, a ground pattern and a trace. The substrate includes a surface. The antenna and the chip pad are formed on the substrate. The ground pattern is formed on the surface. The trace is formed on the surface and isn't connected to the ground pattern. A measuring gap is formed between the trace and an edge of the ground pattern, and the trace includes a first end and a second end. The first end is electrically connected to the chip pad, whereas the second end is electrically connected to the antenna. The bare circuit board is adapted to transmit a signal. The width of the measuring gap is smaller than a quarter of an equivalent wavelength of the signal.

Bare circuit board

An inspection apparatus used for inspecting a bare circuit board is provided, where the bare circuit board includes an antenna. The inspection apparatus includes a holding stage, a probing device, and a measurement device. The holding stage can hold the bare circuit board. The measurement device is electrically connected to the probing device and electrically connected to the antenna via the probing device. The measurement device can input a first testing signal to the antenna. The antenna can input a second testing signal to the measurement device after receiving the first testing signal. The measurement device can measure the antenna according to the second testing signal, where the first testing signal and the second testing signal both pass through no active component.

Inspection apparatus for bare circuit board

A package carrier structure includes an insulating substrate, a first wiring layer, a second wiring layer, at least one conductive via, a plurality of first and second conductive pads, a first insulating layer, a plurality of first and second conductive structures, and an encapsulated layer. The first and second wiring layers are disposed on the upper and lower surfaces of the insulating substrate respectively. The conductive via penetrates through the insulating substrate and electrically connected to the first and second wiring layers. The first and second conductive pads are disposed on the upper surface and electrically connected to the first wiring layer. The first insulating layer is disposed on the upper surface and exposing the first and second conductive pads. The first and second conductive structures are disposed on the first and second conductive pads respectively. The lower surface of the insulating substrate is covered by the encapsulation layer.

Package carrier structure having integrated circuit design and manufacturing method thereof

A circuit board element includes a glass substrate, a first dielectric layer, and a first patterned metal layer. The glass substrate has an edge. The first dielectric layer is disposed on the glass substrate and has a central region and an edge region. The edge region is in contact with the edge of the glass substrate, and the thickness of the central region is greater than the thickness of the edge region. The first patterned metal layer is disposed on the glass substrate and in the central region of the first dielectric layer.

Circuit board element

A circuit board includes a substrate, a first magnetic structure, a first dielectric layer and an inductive coil. The substrate has a top surface and a bottom surface. The first magnetic structure is disposed on the top surface of the substrate. The first dielectric layer covers the substrate and the first magnetic structure. The inductive coil includes a first interconnect, a second interconnect and a plurality of conductive pillars. The first interconnect is disposed on the first dielectric layer. The second interconnect is disposed on the bottom surface of the substrate. The conductive pillars connect the first interconnect and the second interconnect. The first interconnect, the second interconnect and the conductive pillars form a helical structure surrounding the first magnetic structure.

Circuit board and method of manufacturing the same

A packaging substrate is provided, including a substrate body having a plurality of conductive pads, an insulating protective layer formed on the substrate body for the conductive pads to be exposed therefrom, and a plurality of conductive pillars disposed on the conductive pads. Each of the conductive pillars has a bottom end and a top end narrower than the bottom end, thereby forming a cone-shaped structure that does not have a wing structure. Therefore, the distance between contact points is reduced and the demands for fine-pitch and multi-joints are satisfied.

Growing community of inventors

Taoyuan, Taiwan

Yu-Chung Hsieh