Quanta Computer Incorporated

Tekcore Co., Ltd.

Yu Chuan Liu

Yu-Nien Huang

Tsan-Nan Chien

Cheng-Yu Wang

Shun-Ta Yu

Jim-Fat Tseng

Ping-Sheng Kao

Chia Ming Lee

Tsung Liang Cheng

I Ling Chen

Jen Inn Chyi

In a method of forming a crystalline GaN-based material, a first nucleation layer is formed on a substrate at a first temperature, followed with forming a second nucleation layer at a second temperature different from the first temperature. The first and second nucleation layers are composed of AlInGaN. Subsequently, a layer of a crystalline GaN-based compound is epitaxy grown on the second nucleation layer.

Growth process of a crystalline gallium nitride based compound and semiconductor device including gallium nitride based compound

The invention provides a heat-dissipation device and a heat-dissipation method thereof. The electronic device includes a heat source, a thermal interface material (TIM) in contact with the heat source, a heat-dissipation module in contact with the thermal interface material, and an elastic member pushing the heat-dissipation module toward the heat source. The elastic member includes a base and a compressible portion extending from the base, whereby a force, applied to the compressible portion, is transmitted to and uniformly distributed on the base. The heat-dissipation method includes the steps of overlapping a thermal interface material and a heat-dissipation module on the heat source, and exerting a force toward the heat source to the heat-dissipation module.

Heat-dissipation device with elastic member and heat-dissipation method thereof

A heat dissipation device for dissipating heat form a heat source includes a control unit, a sensor, a first heat dissipation module, a second heat dissipation module, and a driving mechanism. The sensor electrical connects with the control unit and detects a temperature of the heat source, and reports the temperature to the control unit. The second heat dissipation module is retractably connected to the first heat dissipation module. The driving mechanism is electrically connected to the control unit and the second heat dissipation module. When the temperature exceeds a first temperature, the control unit informs the driving mechanism to extend away from the second heat dissipation module with respect to the first heat dissipation module.

Heat dissipation device

A heat dissipation device is described. The heat dissipation device is suitable for electrical equipment, and particularly for a notebook computer. The heat dissipation device has a cooling fan and a plurality of heat dissipation fins. The heat dissipation fins are disposed at an outlet of the cooling fan to exhaust heat on the heat dissipation fins with airflow generated by the cooling fan. Each of spaces between the adjacent heat dissipation fins is determined so as to make the airflow velocity uniform. A preferred predetermined space is about C&#xd7;1/(V&#x2212;1), where V is an original airflow velocity at the adjacent heat dissipation fins and Cis a coefficient.

A staggered fin array has a plurality of dissipation fins disposed upright on a substrate. Each dissipation fin has at least one staggered structure at one side or on opposite sides thereof. The staggered structure has two stair structures. Each stair structure has many step surfaces parallel to the airflow direction. An interval surface is formed between adjacent step surfaces. The interval surface is designed as an opening. No more than two leading ledges, formed by the openings, are formed in a single airflow route.

Growing community of inventors

Taoyuan, Taiwan

Yu Chuan Liu