Lite-on Singapore Pte. Ltd.

Lite-on Technology Corporation

Lite-on Opto Technology (changzhou) Co., Ltd.

Yu-Chou Lin

Teck-Chai Goh

Chen-Hsiu Lin

Yi Zhang

Chih-Yuan Chen

Sin-Heng Lim

Suresh Basoor Nijaguna

Chien-Hsiu Huang

Guo-Jun Xu

Kun-Lung Lee

Chen-hsiu Lin

An optical sensing module includes a substrate, an optical sensing device, and a plurality of solders. The substrate has an upper surface, and the upper surface has a plurality of first soldering pads. The optical sensing device is disposed upright on the substrate. The optical sensing device includes a transposition plate and an optical sensing package. The transposition plate includes a first surface, a second surface, and a third surface. The first surface has a plurality of second soldering pads, the second surface has a plurality of conductive through holes, and the third surface has a plurality of metal ribs. The conductive through holes are electrically connected to the second soldering pads and the metal ribs. The optical sensing package is disposed on the first surface and electrically connected to the second soldering pads. The plurality of solders climb onto the plurality of metal ribs, respectively.

Optical sensing module

An optical sensing apparatus includes a base, and an emitter and a detector that are respectively disposed on the base. A package structure covers the emitter and the detector, a first recess portion divides the emitter and the detector, and a second recess portion is located on the detector. A scattering path of light generated by the emitter is altered by the first recess portion and the second recess portion.

Optical sensing apparatus comprising a package structure with a recess portion through which a scattering path of light is altered

A manufacturing method of an optical sensor package includes: disposing a chip on a circuit board, the chip including a light emitting area and a light receiving area; disposing at least one light emitting element, which is electrically connected to the circuit board, on the light emitting area of the chip; coating a light blocking material between the light emitting area and the light receiving area; filling a light permeable material that covers the circuit board, the chip, the light blocking material, and the at least one light emitting element; removing a part of the light permeable material disposed between the light emitting area and the light receiving area, forming a first recess and expose the light blocking material; and filling an anti-light-leakage material in the first recess, to form a lateral light blocking structure through stacking the anti-light-leakage material and the light blocking material.

Optical sensor package and manufacturing method for the same

A manufacturing method of an optical module is provided and includes: attaching a light emitting diode light emitting device and a sensor on a substrate; disposing a first encapsulation portion on the light emitting device and the substrate; disposing a second encapsulation portion on the sensor and the substrate; disposing a shielding layer on the first encapsulation portion, the second encapsulation portion and the substrate; removing a first portion of the first encapsulation portion, a second portion of the second encapsulation portion, and a third portion of the shielding layer, and the first portion corresponds to a position of the light emitting device, the second portion corresponds to a position of the sensor, and the third portion corresponds to the positions of the light emitting device and the sensor; and forming a third encapsulation layer on the shielding layer, the first encapsulation portion and the second encapsulation portion.

Manufacturing method of an optical module

An LED package structure includes a substrate, a circuit layer and an insulating layer both disposed on the substrate, a light-emitting unit, and a reflective housing integrally formed with the insulating layer. The light-emitting unit includes an LED chip and a fluorescent body encapsulating the LED chip. The light-emitting unit is mounted on the insulating layer and the circuit layer. The fluorescent body of the light emitting unit is spaced apart from the circuit layer with a gap in a range of 3&#x2dc;10 &#x3bc;m. The reflective housing is formed on the insulating layer and the circuit layer and is further filled within the gap. A top plane of the reflective housing arranged away from the substrate is lower than or equal to that of the light-emitting unit, and a distance between the two top planes is in a range of 0&#x2dc;30 &#x3bc;m.

Growing community of inventors

Taipei, Taiwan

Yu-Chou Lin