Chunghwa Picture Tubes, Ltd.

Yu-Chou Lee

Wen-Kuang Tsao

Yi-Tsai Hsu

Tsung-Chi Cheng

Hsiang-Hsien Chung

Min-Ching Hsu

Yea-Chung Shih

Ching-Yeh Kuo

Hung-Yi Hsu

Jui-Chung Chang

A semiconductor device and its manufacturing method are disclosed. The nitrogen flow is gradually changed to form a semiconductor device with a gate or a source/drain having a nitrified gradient layer structure. Different extents of nitrification inside the nitrified gradient layer structure provide protection and buffering to prevent the undercut after etching due to different materials in the multilayer structure or the interface effect.

Semiconductor device and its manufacturing method

A thin film transistor source/drain structure and the manufacturing method thereof are disclosed. The thin film transistor source/drain structure uses a sandwich structure to reduce the resistivity of the source/drain and upgrade the reliability. The sandwich structure preferably comprises a structure of AlNdN alloy/AlNd alloy/AlNdN alloy. The AlNdN alloy is used as a buffer layer or a diffusion barrier to prevent the AlNd alloy and an amorphous silicon layer from diffusing into each other. The other AlNdN alloy is used as a glue layer and to protect the AlNd alloy from being over-etched. The other AlNdN alloy can also prevent the AlNd alloy and the following formed ITO from contact and interaction.

Thin film transistor structure and manufacturing method thereof

A Thin Film Transistor (TFT) manufacture method, comprising manufacture of a gate, a gate isolation layer, a channel layer, and a source/drain. Wherein, the manufacture of the channel layer comprises: forming a first a-Si layer by using a low deposition rate (LDR) (Chemical Vapor Deposition, CVD); forming a second a-Si layer by using a high deposition rate (HDR); and forming an N+Mixed a-Si layer. When the first a-Si layer is formed in the present invention, the flux ratio of H/SiHis adjusted to a range from 0.40 to 1.00 to increase the number of defects in the first a-Si layer. When the TFT is irradiated by the light, the photo leakage current generated in the channel layer is trapped in the defects in the first a-Si layer. Therefore, the TFT photo leakage current can be significantly reduced.

Thin film transistor manufacture method

A method for fabricating a thin film transistor (TFT) is described. A MoNb gate is formed on a substrate, and an insulating layer is formed on the substrate covering the gate. A channel layer is formed on the insulating layer above the gate, and a source/drain is formed on the channel layer to constitute a TFT. Since the gate is constituted of a MoNb layer, the contact resistance thereof can be reduced.

Thin film transistor and fabricating method thereof

A method for reducing the contact resistance using plasma process tries to solve the problem that the cleaning process could not remove both the residues and oxides on the etched surface effectively. A plasma treating process is performed after the cleaning process and before any following process. Herein, the plasma treating process uses the plasma(s) to physically and/or chemically react with the etched surface. For example, inert gas plasma is used to remove these residues and the oxides, and then hydrogen plasma is used to compensate the unsaturated bonds by inducing the ions bombardment of the inert gas plasma.

Method for reducing the contact resistance

A Thin Film Transistor (TFT) manufacture method, comprising manufacture of a gate, a gate isolation layer, a channel layer, and a source/drain. Wherein, the manufacture of the channel layer comprises: forming a first a-Si layer by using a low deposition rate (LDR) (Chemical Vapor Deposition, CVD); forming a second a-Si layer by using a high deposition rate (HDR); and forming an N&plus;Mixed a-Si layer. When the first a-Si layer is formed in the present invention, the flux ratio of H /SiH is adjusted to a range from 0.40 to 1.00 to increase the number of defects in the first a-Si layer. When the TFT is irradiated by the light, the photo leakage current generated in the channel layer is trapped in the defects in the first a-Si layer. Therefore, the TFT photo leakage current can be significantly reduced.

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Taipei, Taiwan

Yu-Chou Lee