Taiwan Semiconductor Manufacturing Comp. Ltd.

Yu-Ching Lo

Ching-Hua Hsieh

Yi-Yang Lei

Ching-Pin Yuan

Cheng-Yu Kuo

Wei-Jie Huang

Wen-Chih Lin

A workpiece chuck includes a supporting platform, a vacuum system, and a gas permeable buffer layer. The supporting platform has a supporting surface for holding a workpiece thereon. The vacuum system is disposed under and in gas communication with the supporting platform. The gas permeable buffer layer is disposed over the supporting platform and covers the supporting surface, wherein a hardness scale of the gas permeable buffer layer is smaller than a hardness scale of the supporting platform.

Workpiece chuck, workpiece handling apparatus, manufacturing method of semiconductor package

A lamination chuck for lamination of film materials includes a support layer and a top layer. The top layer is disposed on the support layer. The top layer includes a polymeric material having a Shore A hardness lower than a Shore hardness of a material of the support layer. The top layer and the support layer have at least one vacuum channel formed therethrough, vertically extending from a top surface of the top layer to a bottom surface of the support layer.

Lamination process, and manufacturing method of semiconductor package using a chuck

Chuck, lamination process, and manufacturing method of semiconductor package using the same

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Hsinchu, Taiwan

Yu-Ching Lo