Getac Technology Corporation

Mitac International Corporation

Mitac Technology Corporation

Other

Yu-Chiang Cheng

Ping-Cheng Chang

Cheng-Zing Chou

Shyh-Jong Chung

Wei-Chung Hsiao

Chao-Yi Chen

Yu-Hsin Wang

Ming-Hang Hwang

Hsin-Lung Kuo

Bin-Wei Lee

Ching-Wei Ling

Ping-Feng Lee

Kuo-Ming Chuang

Hsueh-Chin Liao

A circuit structure for modifying characteristic impedance by using different reference planes is provided. The structure comprises an analog signal line, a digital signal line, a corresponding reference plane for analog signals and a corresponding reference plane for digital signals. Wherein, the line width of the analog signal line is the same as that of the digital signal line. In addition, the distance between the analog signal line and the corresponding analog signal reference plane is longer than the distance between the digital signal line and the corresponding digital signal reference plane. Accordingly, the characteristic impedance mismatch during signal transmission can be solved and the quality of signal transmission can be improved.

Circuit structure and circuit substance for modifying characteristic impedance using different reference planes

Disclosed is a dual-band monopole antenna with antenna signal fed through a short-circuit terminal of a transmission line load. The dual-band monopole antenna includes an antenna extension section and a transmission line load. The antenna extension section has a top terminal and a transmission line connection terminal. The transmission line connection terminal is connected to the transmission line load. The transmission line load includes a core transmission line, an outer circumferential conductor, and a dielectric layer. The core transmission line has an extension section connection terminal and a signal feeding terminal. The extension section connection terminal is connected to the transmission line connection terminal of the antenna extension section. The outer circumferential conductor circumferentially surrounds and is spaced from the core transmission line by a given distance and the outer circumferential conductor has an open terminal and a short-circuit terminal.

Dual-band monopole antenna with antenna signal fed through short-circuit terminal of transmission line

An electronic device includes a helical resilient member serving as an electrical inductance element. The electronic device also includes an antenna, a signal feeding line, and a transmitting/receiving module. The helical resilient member has first and second ends with a predetermined number of turns of coil arranged therebetween the first and second ends, and is made of electrically conductive materials so that the turns of coil defines an electrical inductance. The signal feeding line is connected between the helical resilient member and a signal feed point of the antenna. The transmitting/receiving module is connected to the helical resilient member so as to couple the inductance of the helical resilient member to the transmitting/receiving module.

Electronic device having helical resilient member serving as electric inductance element

An antenna device with a surface antenna pattern is formed either on an internal surface or on the external surface of a casing of an electronic device by film coating technology. The surface antenna pattern is either directly connected to a signal feeding line or connected to a signal feeding line through a signal guiding passage. In an embodiment, a recess is pre-formed on the external surface of the casing and then a surface antenna pattern is coated to the recess. The antenna device may further comprise an antenna coupling element arranged at the internal surface of the casing, in opposite to the surface antenna pattern. The antenna coupling element is inductively coupled with the surface antenna pattern for transceiving the signals to the electronic device.

Antenna device with surface antenna pattern integrally coated casing of electronic device

Disclosed is a transmission line loaded dual-band monopole antenna, which realizes operation in dual bands with a single antenna. The dual-band monopole antenna includes a monopole antenna and a transmission line load. The monopole antenna has a signal feeding terminal and a load connection terminal. The load connection terminal is connected to the transmission line load. The transmission line load includes a core transmission line, an outer circumferential conductor, and a short-circuit section. The core transmission line has an antenna connection terminal and a short-circuit terminal. The antenna connection terminal is connected to the load connection terminal of the monopole antenna. The outer circumferential conductor circumferentially surrounds and is spaced from the core transmission line and the outer circumferential conductor has an open terminal and a short-circuit terminal. The opening of the open terminal of the outer circumferential conductor faces the antenna connection terminal of the core transmission line so that the outer circumferential conductor forms an open structure facing the monopole antenna.

Transmission line loaded dual-band monopole antenna

Disclosed is a planar inverted-F antenna with an extended grounding plane. The planar inverted-F antenna has a grounding metal plate having a selected side edge on which the extended grounding plane is formed and has a predetermined height. At least one antenna signal radiating plate is connected to the grounding metal plate by a short-circuit piece and is substantially parallel to and spaced from the grounding metal plate by a distance. A feeding point extends from the antenna signal radiating plate in a direction toward the grounding metal plate and corresponds to the extended grounding plane with a predetermined gap therebetween. With the arrangement of the extended grounding plane, the impedance matching of the antenna is improved and the impedance bandwidth of the antenna is increased.

Planar inverted-F antenna with extended grounding plane

Disclosed is an antenna device for transceiving a wireless signal with an insert-molded antenna pattern embedded inside a casing of an electronic device. The insert-molded antenna pattern is connected to an antenna module of a motherboard of the electronic device in order to feed the wireless signal transceived by the insert-molded antenna pattern through an antenna signal feeding line connected to the insert-molded antenna pattern and the antenna module, or by an antenna coupling element coupled with the insert-molded antenna pattern.

Antenna device with insert-molded antenna pattern

Disclosed is an antenna device for transceiving a wireless signal. The antenna device includes an antenna element adapted to establish a radiation pattern during transceiving the wireless signal; an antenna signal feeding line coupling to the antenna element for feeding the wireless signals transceived by the antenna element; and at least one radiation pattern adjustment element arranged at an adjacent position with respect to the antenna element and within the established radiation pattern of the antenna element to adjust the radiation pattern of the antenna element.

Antenna device with radiation pattern adjustment element

Disclosed is an antenna device arranged inside a display module of an electronic device with a conductive portion. The antenna device includes an antenna element with a ground plane and a signal feeding end for transceiving a wireless signal, an antenna signal feeding line coupled to the signal feeding end of the antenna element for feeding the wireless signal transceived by the antenna element. At least one mounting element for fixing the antenna element onto the casing and forcing the ground plane of the antenna electrically contacting with the conductive portion of the casing, so that the conductive porting serves as an extended ground for the ground plane of the antenna element.

Antenna device with ground plane coupled to conductive portion of an electronic device

Disclosed is an antenna device for transceiving a wireless signal with an ion-implanted antenna pattern implanted inside a casing of an electronic device. The ion-implanted antenna pattern is connected to an antenna module of a motherboard of the electronic device in order to feed the wireless signal transceived by the ion-implanted antenna pattern, while the connection could be either by an antenna signal feeding line connected to the ion-implanted antenna pattern and the antenna module, or by an antenna coupling element coupled with the ion-implanted antenna pattern and connected to an antenna signal feeding line.

Antenna device with ion-implanted antenna pattern

This invention discloses a manufacturing method and a structure for printed circuit boards. The printed circuit boards are often used for supporting electronic components in circuit and conducting the heat from electronic components. The printed circuit board structure includes a laminated structure. The laminated structure comprises an electric conduction layer and an insulation layer. The electric conduction layer can be made of a special thermal conduction material, including a metal and a bracket structure of carbon element. The insulation layer can be made of thermal conduction material as well, combining a bracket structure of carbon element. The bracket structure of carbon element has high thermal conductivity so as to improve the heat conduction efficiency. The corresponding manufacturing method for this thermal conduction material can be made with chemical vapor deposition, physical vapor deposition, electroplating or the other materials preparation method. The bracket structure of carbon element can be coated on a surface of the metal and also can be mixed into the metal.

Printed circuit board structure and manufacturing method thereof

Disclosed is a coupling antenna device for transceiving a plurality of wireless signals with multiple radiation frequencies. The coupling antenna device includes an antenna pattern having a plurality of adjacent resonating sectors, each of the resonating sectors having a length determined by a specific radiation frequency responsive to one of the wireless signals.

Coupling antenna device having antenna pattern with multi-frequency resonating sectors

Disclosed is an antenna device having a substrate, an antenna element for transceiving a wireless signal, an antenna signal feeding line for feeding the wireless signal, and an ion-implanted resonant pattern, which includes a first coupling pattern implanted in the substrate by an Ion-implantation process and a second coupling pattern formed at a position corresponding to the first coupling pattern with a predetermined distance therebetween, formed at an adjacent position with respect to the antenna element. As the antenna element transceives the wireless signal of the predetermined radiation frequency and generates an induction voltage, the first coupling pattern and the second coupling pattern each generates a coupled induction voltage and a capacitance therebetween, hence forming a resonance with the antenna element.

Antenna device with ion-implanted resonant pattern

This invention discloses a manufacturing method and a structure for a chip heat dissipation. This heat dissipation structure includes a bottom plate of circuit structure, a die of central processing unit and a cap. The cover is often used in conducting the waste heat generated from the chip. The cover can be made of a special thermal conduction material, including a metal and a bracket structure of carbon element which have high thermal conductivity so as to improve the efficiency of heat conduction. The corresponding manufacturing method for this heat conduction material can be made with chemical vapor deposition, physical vapor deposition, electroplating or the other materials preparation method. The bracket structure of carbon element can be coated on the metal surface and also can be mixed into the metal.

Chip heat dissipation structure and manufacturing method

A multi-layer circuit board includes first, second, third, fourth, fifth, sixth and seventh insulating substrates; first, second, third, fourth and fifth signal wiring layers; first and second ground wiring layers; and a power wiring layer. Each of the first and seventh insulating substrates has a thickness ranging from 2.5 to 6.5 mil. Each of the second, fourth and sixth insulating substrates has a thickness ranging from 3 to 9 mil. Each of the third and fifth insulating substrates has a thickness ranging from 3 to 23 mil. The first signal wiring layer has a first resistance with respect to the first ground wiring layer. The second signal wiring layer has a second resistance with respect to the first ground wiring layer and the power wiring layer. The third signal wiring layer has a third resistance with respect to the first ground wiring layer and the power wiring layer. The fourth signal wiring layer has a fourth resistance with respect to the second ground wiring layer and the power wiring layer. The fifth signal wiring layer has a fifth resistance with respect to the second ground wiring layer. The first, second, third, fourth and fifth resistances are within the range of 49.5 to 60.5 ohms.

Growing community of inventors

Taipei, Taiwan

Yu-Chiang Cheng